公开(公告)号：US20170363958A1

公开(公告)日：2017-12-21

申请号：US15185841

申请日：2016-06-17

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Cheng-Chung LEE ,  Yeong-Tong HWANG ,  Shih-Hung HSU ,  Shao-En HWANG

IPC: G03F7/031 ,  H05K1/02 ,  H05K1/03 ,  G03F7/038

CPC classification number: G03F7/031 ,  G03F7/0047 ,  G03F7/027 ,  G03F7/038 ,  G03F7/0385 ,  G03F7/0388 ,  H05K3/3452

Abstract: A low dielectric constant (Dk) and dissipation factor (Df) of solder resistant mask composition having excellent photo and thermocurability, and high developability resolution with an alkaline aqueous solution, wherein the dielectric constant is below 3.20 (1 GHz), and the dissipation factor is less than 0.015 (1 GHz); and wherein the composition comprises (A) a photopolymerizable prepolymer; (B) a photopolymerizable vinyl monomer; (C) an epoxy compound; (D) a photopolymerization initiator; (E) an inorganic filler; (F) a catalyst; and (G) an organic solvent.

公开(公告)号：US20170267807A1

公开(公告)日：2017-09-21

申请号：US15071733

申请日：2016-03-16

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Cheng-Chung LEE ,  Yeong-Tong HWANG ,  Chen-Hua WU ,  Jaou-Shain YU

IPC: C08G59/14 ,  H05K1/03 ,  C09D163/00

CPC classification number: H05K1/0373 ,  C08G59/02 ,  C08G65/485 ,  C09D163/00 ,  H05K1/0237 ,  H05K1/0366 ,  H05K2201/012

Abstract: The invention provides a polyphenylene ether modified phenol-benzaldehyde multifunctional epoxy resin with formula (I). whereinA is: PPE are: Z are: Y are: Their manufactured is following steps: polyphenylene ether 100 parts is dissolved in solvent, then phenol-benzaldehyde multifunctional epoxy resin 100˜450 parts and catalyst 0.01˜5 parts are added, stirred and mixed at 90˜180□, for 1˜4 hour, to obtain formula (I) solution. Said product is formulated with compositions for laminate, having excellent electrical properties and heat resistance. The dielectric constant is 4.03 (1 GHz), dissipation factor is 0.0046 (1 GHz) and no delamination longer than 60 minutes dipping in 288 soldering test after 2 hours pressure cooking test. Application is insulating materials for highly reliable electronic components such as EMC, PCB substrates, laminate and insulating plates.