Multilayer printed board with a double plane spiral interconnection structure
    1.
    发明申请
    Multilayer printed board with a double plane spiral interconnection structure 失效
    多层印刷板具有双面螺旋互连结构

    公开(公告)号:US20020109573A1

    公开(公告)日:2002-08-15

    申请号:US10093482

    申请日:2002-03-11

    Inventor: Mizuki Iwanami

    Abstract: An inductor device having plural spiral-shaped interconnection structures connected to each other and extending in plural power source layers, the power source layers being in different levels of a multilayer printed board. The printed board having first and second current loops. The loops share part of a common current path.

    Abstract translation: 一种电感器件,具有多个螺旋形互连结构,彼此连接并在多个电源层中延伸,所述电源层处于多层印刷电路板的不同级别。 该印刷电路板具有第一和第二电流回路。 循环共享公共当前路径的一部分。

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