公开(公告)号：US20040173891A1

公开(公告)日：2004-09-09

申请号：US10802782

申请日：2004-03-18

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Ryuji Imai ,  Masao Kuroda ,  Yasuhiro Sugimoto

IPC: H01L023/02

CPC classification number: H01L23/49827 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15313 ,  H05K1/0306 ,  H05K3/3436 ,  H05K3/4076 ,  H05K2201/09572 ,  H05K2201/10378 ,  H05K2201/10674 ,  Y02P70/613 ,  H01L2924/00

Abstract: An intermediate board comprising: an intermediate board body having first and second faces wherein a semiconductor device is to be mounted on at least one of said first and second faces, said semiconductor device having a coefficient of thermal expansion that is equal to or larger than 2.0 ppm/null C. and smaller than 5.0 ppm/null C., and having surface mount terminals, said intermediate board body having a plurality of through holes through which said first and second faces communicate with each other, said intermediate board body containing an inorganic insulating material; and a plurality of conductor columns filling said through holes and containing a conductive metal, said conductor columns being to be connected with said surface mount terminals.

Abstract translation: 一种中间板，包括：具有第一和第二面的中间板体，其中将半导体器件安装在所述第一和第二面中的至少一个面上，所述半导体器件具有等于或大于2.0的热膨胀系数 ppm /℃，小于5.0ppm /℃，并且具有表面贴装端子，所述中间板体具有多个通孔，所述第一和第二表面相互连通，所述中间板主体包含无机 绝缘材料; 以及填充所述通孔并包含导电金属的多个导体柱，所述导体柱将与所述表面安装端子连接。

公开(公告)号：US20020159243A1

公开(公告)日：2002-10-31

申请号：US10183521

申请日：2002-06-28

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Kouki Ogawa ,  Yasuhiro Sugimoto

IPC: H05K007/06

CPC classification number: H05K1/0231 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15192 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/113 ,  H05K2201/10545 ,  H05K2201/10636 ,  H05K2201/10734 ,  Y02P70/611

Abstract: A wiring board simplifying connection of electronic parts mounted on a principal face side of the wiring board and chip capacitors mounted on a reverse face side thereof in such a manner that the wiring board 100 mounting the chip capacitors 160 on a reverse face 101c-side comprises bumps 129 capable of being connected to IC chip 10, first and second capacitor connecting pads 149p, 149g connecting the upper face parts 163 of the chip capacitors 160, a plurality of insulating layers 121, 111, 141 intervening the first and the second capacitor connecting pads, and first and second converting-conductor layers 146p, 146g in stripe pattern formed at interlayer 152, connected to the bumps 129 at the principal face 101b-side, connected to the first capacitor connecting pads 149p at the reverse face 101c-side or the second capacitor connecting pads 149g for changing the connecting positions or the connecting number between the principal face side and the reverse face side.

Abstract translation: 布线板简化安装在布线板的主面侧的电子部件和安装在其背面侧的贴片电容器的连接，使得将贴片电容器160安装在反面101c侧上的布线板100包括 能够连接到IC芯片10的突起129，连接片状电容器160的上表面部分163的第一和第二电容器连接焊盘149p，149g，插入第一和第二电容器连接的多个绝缘层121,111,141 焊盘以及连接到反射面101c侧的第一电容器连接焊盘149p的连接到主面101b侧的凸块129的形成在层间152处的条纹图案的第一和第二转换导体层146p，146g， 用于改变连接位置的第二电容器连接焊盘149g或主面侧和反面侧之间的连接数。

公开(公告)号：US20020086561A1

公开(公告)日：2002-07-04

申请号：US10012312

申请日：2001-12-12

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Kouki Ogawa ,  Yasuhiro Sugimoto

IPC: H05K001/00

CPC classification number: H01L23/49822 ,  H01L23/49838 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15192 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0231 ,  H05K1/113 ,  H05K2201/10545 ,  H05K2201/10636 ,  H05K2201/10734 ,  Y02P70/611

Abstract: A wiring board simplifying connection of electronic parts mounted on a principal face side of the wiring board and chip capacitors mounted on a reverse face side thereof in such a manner that the wiring board 100 mounting the chip capacitors 160 on a reverse face 101c-side comprises bumps 129 capable of being connected to IC chip 10, first and second capacitor connecting pads 149p, 149g connecting the upper face parts 163 of the chip capacitors 160, a plurality of insulating layers 121, 111, 141 intervening the first and the second capacitor connecting pads, and first and second converting-conductor layers 146p, 146g in stripe pattern formed at interlayer 152, connected to the bumps 129 at the principal face 101b-side, connected to the first capacitor connecting pads 149p at the reverse face 10c-side or the second capacitor connecting pads 149g for changing the connecting positions or the connecting number at the principal face side and the reverse face side.

Abstract translation: 布线板简化安装在布线板的主面侧的电子部件和安装在其背面侧的贴片电容器的连接，使得将贴片电容器160安装在反面101c侧上的布线板100包括 能够连接到IC芯片10的突起129，连接片状电容器160的上表面部分163的第一和第二电容器连接焊盘149p，149g，插入第一和第二电容器连接的多个绝缘层121,111,141 焊盘以及连接到主表面101b侧的凸点129连接到反面10c侧的第一电容器连接焊盘149p的中间层152处形成的条纹图案的第一和第二转换导体层146p，146g， 用于改变连接位置的第二电容器连接焊盘149g或主面侧和反面侧的连接数。