公开(公告)号：US20230345640A1

公开(公告)日：2023-10-26

申请号：US17913055

申请日：2021-03-05

Applicant: NITTO DENKO CORPORATION

Inventor： Shusaku SHIBATA ,  Shun SHIGA ,  Teppei NIINO

IPC: H05K3/00 ,  H05K1/11 ,  H05K3/28

CPC classification number: H05K3/0097 ,  H05K1/118 ,  H05K3/28 ,  H05K3/4608

Abstract: An assembly sheet as a wiring circuit board assembly sheet includes a metal substrate, a wiring circuit structure portion, and a dummy structure portion. The metal substrate includes a product region and a frame region adjacent thereto. The wiring circuit structure portion is disposed on one surface in a thickness direction of the metal substrate in the product region, and includes a terminal portion. The dummy structure portion is disposed on one surface in the thickness direction of the metal substrate in the frame region, includes a plurality of conductive layers aligned in the thickness direction, and has a greater height above the metal substrate than the terminal portion.

公开(公告)号：US20240040705A1

公开(公告)日：2024-02-01

申请号：US18256170

申请日：2021-11-01

Applicant: NITTO DENKO CORPORATION

Inventor： Rihito FUKUSHIMA ,  Takahiro IKEDA ,  Shun SHIGA

IPC: H05K3/10 ,  H05K1/02 ,  H05K3/00 ,  H05K3/18

CPC classification number: H05K3/108 ,  H05K1/0296 ,  H05K3/0097 ,  H05K3/18 ,  H05K2203/0723 ,  H05K2201/09236

Abstract: A wiring circuit board assembly sheet includes a wiring circuit board including a conductive pattern and a frame including a dummy conductive pattern. The frame includes a dummy formation region. The dummy formation region includes the dummy conductive pattern. The dummy formation region has a width of 5 mm from an edge of the wiring circuit board and a length identical to that of the wiring circuit board in a direction in which the edge extends. The difference between the percentage of the area of the conductive pattern to the area of the insulating base layer and the percentage of the area of the dummy conductive pattern to the area of the dummy formation region is 50% or less.