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公开(公告)号：US20240206079A1
公开(公告)日：2024-06-20
申请号：US18532897
申请日：2023-12-07
Applicant: NITTO DENKO CORPORATION
Inventor： Takahiro IKEDA , Teppei NIINO
CPC classification number: H05K3/38 , H05K1/0298
Abstract: A wiring circuit board includes a metal supporting layer, an adhesion layer, a first conductive layer, an insulating layer, and a second conductive layer. The adhesion layer is disposed on one-side surface of the metal supporting layer in the thickness direction, and contains at least one metal selected from the group Zr, Ti, W, Mo, V, Y, Nb, and Ta. The first conductive layer is disposed on one-side surface of the adhesion layer in the thickness direction, and has an insulating layer with a penetrating hole disposed on a one-side surface thereof. The second conductive layer includes a portion electrically connected with the metal supporting layer through the adhesion layer located in the penetrating hole. The second conductive layer is located at one side of the metal supporting layer in the penetrating hole and one side of the insulating layer in the thickness direction.
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公开(公告)号：US20240040705A1
公开(公告)日：2024-02-01
申请号：US18256170
申请日：2021-11-01
Applicant: NITTO DENKO CORPORATION
Inventor： Rihito FUKUSHIMA , Takahiro IKEDA , Shun SHIGA
CPC classification number: H05K3/108 , H05K1/0296 , H05K3/0097 , H05K3/18 , H05K2203/0723 , H05K2201/09236
Abstract: A wiring circuit board assembly sheet includes a wiring circuit board including a conductive pattern and a frame including a dummy conductive pattern. The frame includes a dummy formation region. The dummy formation region includes the dummy conductive pattern. The dummy formation region has a width of 5 mm from an edge of the wiring circuit board and a length identical to that of the wiring circuit board in a direction in which the edge extends. The difference between the percentage of the area of the conductive pattern to the area of the insulating base layer and the percentage of the area of the dummy conductive pattern to the area of the dummy formation region is 50% or less.
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公开(公告)号：US20240008178A1
公开(公告)日：2024-01-04
申请号：US18253892
申请日：2021-10-29
Applicant: NITTO DENKO CORPORATION
Inventor： Shusaku SHIBATA , Takahiro IKEDA , Teppei NIINO
CPC classification number: H05K1/113 , H05K3/44 , H05K2201/09481 , H05K2201/09554 , H05K2201/09618 , H05K2201/09609 , H05K2201/0979 , H05K1/056
Abstract: A wiring circuit board includes a metal supporting board; an insulating layer; and a conductive layer in this order in a thickness direction. The conductive layer includes a terminal portion, and a tail line portion extending from the terminal portion. The terminal portion has a via portion that penetrates the insulating layer in the thickness direction and is connected to the metal supporting board. The tail line portion has a base end portion that has a width different from a width of the terminal portion in a direction orthogonal to the extending direction of the tail line portion and that is connected with the terminal portion; and a second via portion that penetrates the insulating layer in the thickness direction and that is connected to the metal supporting board.
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Patent Agency Ranking
公开(公告)号：US20240206053A1
公开(公告)日：2024-06-20
申请号：US18532910
申请日：2023-12-07
Applicant: NITTO DENKO CORPORATION
Inventor： Takahiro IKEDA , Teppei NIINO , Shusaku SHIBATA , Shoei TETSUKAWA
CPC classification number: H05K1/0278 , H05K3/007 , H05K2201/09063
Abstract: A method for producing a wiring circuit board includes a step (1) of producing a substrate with a metal support board including a metal support board and a step (2) of etching the metal support board. The wiring circuit board includes a frame, a mounting portion, an opening portion, and a joint. Each of the frame and the mounting portion includes a metal support layer, a base insulating layer, a conductive layer, and a cover insulating layer. The joint does not include the metal support layer. In step (2), by etching the metal support board corresponding to the opening portion and the joint from the other side in the thickness direction by using an etching resist, the metal support layer is formed.
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公开(公告)号：US20240015884A1
公开(公告)日：2024-01-11
申请号：US18252308
申请日：2021-10-28
Applicant: NITTO DENKO CORPORATION
Inventor： Shusaku SHIBATA , Takahiro IKEDA , Teppei NIINO
CPC classification number: H05K1/0298 , H05K3/429 , H05K3/4076 , H05K1/092 , H05K2201/0338
Abstract: Provided is a wiring circuit board that includes a metal supporting board; a first metal thin film; an insulating layer; a second metal thin film; and a conductive layer in order toward one side in a thickness direction. The metal supporting board includes a metal supporting layer and a surface metal layer. The surface metal layer is disposed on one surface in the thickness direction of the metal supporting layer and has higher conductivity than the metal supporting layer. The insulating layer has a through hole. The conductive layer has a via portion. The via portion is disposed in the through hole and is electrically connected to the metal supporting board.
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公开(公告)号：US20230422397A1
公开(公告)日：2023-12-28
申请号：US18339005
申请日：2023-06-21
Applicant: NITTO DENKO CORPORATION
Inventor： Takahiro IKEDA , Taketo ISHIKAWA , Yuki TAKEDA , Hironori KUWAYAMA , Kyotaro YAMADA
CPC classification number: H05K1/036 , H05K3/467 , H05K2203/0315
Abstract: A wiring circuit board includes a metal supporting board, first and second metal thin films, an insulating layer, and a conductive layer, where the resistance between the conductive layer and metal supporting board are lowered. The first metal thin film is disposed on one surface of the metal supporting board in the thickness direction, with the insulating layer having a through hole. The second metal thin film is disposed on one surface of the insulating layer in the thickness direction with the conductive layer disposed thereon. In the through hole, the first and second metal thin films, whose surfaces contact, are disposed between the metal supporting board and the conductive layer, and the other surface of the first metal thin film is in contact with the one surface of the metal supporting board. The other surface of the second metal thin film is in contact with the conductive layer.
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公开(公告)号：US20230413431A1
公开(公告)日：2023-12-21
申请号：US18330058
申请日：2023-06-06
Applicant: NITTO DENKO CORPORATION
Inventor： Takahiro IKEDA , Kyotaro YAMADA , Taketo ISHIKAWA , Hironori KUWAYAMA , Yuki TAKEDA
CPC classification number: H05K1/0298 , H05K1/05 , H05K1/09 , H05K3/4673 , H05K3/4038
Abstract: A wiring circuit board includes a metal supporting layer, a first metal thin film, an insulating layer including a through hole, a second metal thin film disposed on the first metal thin film in the through hole, and a conductive pattern electrically connected to the metal supporting layer through the first metal thin film and the second metal thin film in the through hole. The first metal thin film includes an oxide coating at least on a contact surface in contact with the insulating layer. In the central part of the through hole, the oxide coating has a thickness of 0 or a thickness smaller than a thickness of the oxide coating on the contact surface.
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公开(公告)号：US20230133282A1
公开(公告)日：2023-05-04
申请号：US17973186
申请日：2022-10-25
Applicant: NITTO DENKO CORPORATION
Inventor： Takahiro IKEDA , Teppei NIINO
Abstract: A wiring circuit board includes a metal support board, a first metal thin film, an insulating layer, a second metal thin film, and a conductive layer in a thickness direction order. The insulating layer includes a through hole penetrating in the thickness direction, which includes a first opening end at the first metal thin film side, a second opening end opposite to the first opening end, and an inner wall surface between the first and-the second opening ends. The first metal thin film includes a first opening portion, which overlaps the first opening end in a projection view in the thickness direction. The second metal thin film includes a second opening portion, which overlaps the first opening portion and the second opening end in a projection view in the thickness direction. The conductive layer has a via portion disposed in the through hole and connected to the metal support board.
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