公开(公告)号：US20240023237A1

公开(公告)日：2024-01-18

申请号：US18253894

申请日：2021-10-26

Applicant: NITTO DENKO CORPORATION

Inventor： Rihito FUKUSHIMA ,  Shusaku SHIBATA ,  Teppei NIINO

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0281 ,  H05K1/189 ,  H05K2201/09727 ,  H05K2201/0191

Abstract: A wiring circuit board includes a first insulating layer and a conductive pattern. The conductive pattern has a first terminal, and a wiring connected to the first terminal. The wiring has a first portion disposed away from the first terminal, and a second portion disposed between the first terminal and the first portion. The first portion of the wiring and the first terminal include a portion consisting of the first conductive layer and the second conductive layer. The second portion of the wiring consists of the first conductive layer.

公开(公告)号：US20240260173A1

公开(公告)日：2024-08-01

申请号：US18561206

申请日：2022-01-21

Applicant: NITTO DENKO CORPORATION

Inventor： Yusaku TAMAKI ,  Rihito FUKUSHIMA ,  Teppei NIINO

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K1/0266 ,  H05K3/0038 ,  H05K2201/09936

Abstract: A method for producing a wiring circuit board assembly sheet includes a marking step of forming a mark made of a recessed portion in a metal support board, and after the marking step, an insulating layer forming step of forming a base insulating layer on one surface in a thickness direction of the metal support board formed with the mark.

公开(公告)号：US20230008736A1

公开(公告)日：2023-01-12

申请号：US17783546

申请日：2020-11-12

Applicant: NITTO DENKO CORPORATION

Inventor： Shusaku SHIBATA ,  Rihito FUKUSHIMA ,  Teppei NIINO

IPC: H05K3/40 ,  H05K1/02 ,  H05K1/05 ,  H05K1/11 ,  H05K3/44 ,  H05K3/46

Abstract: A method for manufacturing a wiring circuit board that is a double-sided wiring circuit board includes a first step of preparing a laminate and a second step. The laminate includes a metal core layer, insulating layer, and conductor layers. The insulating layer has a region and an opening that are adjacent to each other. The insulating layer has a region including a part facing the region in a thickness direction, and an opening adjacent to the region. The conductor layer includes a wiring portion and a conductive portion. The conductor layer includes a wiring portion and a conductive portion. In the second step, the first and second etching treatments for etching the metal core layer through the openings are carried out to form a via portion having a periphery surrounded by a space, extending between the regions, and connected to the conductive portions.

公开(公告)号：US20220408556A1

公开(公告)日：2022-12-22

申请号：US17776476

申请日：2020-11-05

Applicant: NITTO DENKO CORPORATION

Inventor： Rihito FUKUSHIMA ,  Shusaku SHIBATA ,  Yusaku TAMAKI

IPC: H05K1/02

Abstract: A wiring circuit board includes an insulating layer, a pair of wiring layers, an insulating layer, and a wiring layer. The pair of wiring layers are disposed on the insulating layer and extend side by side apart from each other. The insulating layer is disposed on the insulating layer so as to cover the pair of wiring layers. The wiring layer is disposed on the insulating layer and extends along the pair of wiring layers, while facing to the pair of wiring layers in a thickness direction of the wiring layer. The wiring layer has a ridge portion. The ridge portion protrudes into the insulating layer toward a region between the wiring layers and extends along the region.

公开(公告)号：US20220386459A1

公开(公告)日：2022-12-01

申请号：US17775797

申请日：2020-10-13

Applicant: NITTO DENKO CORPORATION

Inventor： Rihito FUKUSHIMA ,  Hayato TAKAKURA ,  Naoki SHIBATA

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/18

Abstract: A wiring circuit board includes a base insulating layer; a first wiring disposed on the base insulating layer; an intermediate insulating layer disposed on the base insulating layer so as to cover the first wiring; a second wiring disposed on the intermediate insulating layer; a single layer first terminal, disposed on the base insulating layer, and electrically connected to the first wiring; and a single layer second terminal, disposed on the base insulating layer, and electrically connected to the second wiring. The first terminal is continuous with the first wiring. The second terminal is discontinuous from the second wiring. The wiring circuit board further includes a connecting portion disposed on the base insulating layer and continuous with the second terminal to electrically connect to the second wiring.

公开(公告)号：US20250107755A1

公开(公告)日：2025-04-03

申请号：US18834828

申请日：2023-01-25

Applicant: Nitto Denko Corporation

Inventor： Rihito FUKUSHIMA ,  Yusuke SHIMIZU ,  Yoshihiro TOYODA ,  Kengo YAMAUCHI

IPC: A61B5/00 ,  A61B5/0507 ,  A61B34/30

Abstract: Provided is a robot configured to naturally obtain biological information. The robot includes an external member; and an electromagnetic wave sensor that is provided internally of the external member and is configured to obtain biological information of a user by using electromagnetic waves.

公开(公告)号：US20240040705A1

公开(公告)日：2024-02-01

申请号：US18256170

申请日：2021-11-01

Applicant: NITTO DENKO CORPORATION

Inventor： Rihito FUKUSHIMA ,  Takahiro IKEDA ,  Shun SHIGA

IPC: H05K3/10 ,  H05K1/02 ,  H05K3/00 ,  H05K3/18

CPC classification number: H05K3/108 ,  H05K1/0296 ,  H05K3/0097 ,  H05K3/18 ,  H05K2203/0723 ,  H05K2201/09236

Abstract: A wiring circuit board assembly sheet includes a wiring circuit board including a conductive pattern and a frame including a dummy conductive pattern. The frame includes a dummy formation region. The dummy formation region includes the dummy conductive pattern. The dummy formation region has a width of 5 mm from an edge of the wiring circuit board and a length identical to that of the wiring circuit board in a direction in which the edge extends. The difference between the percentage of the area of the conductive pattern to the area of the insulating base layer and the percentage of the area of the dummy conductive pattern to the area of the dummy formation region is 50% or less.

公开(公告)号：US20230015337A1

公开(公告)日：2023-01-19

申请号：US17783537

申请日：2020-12-15

Applicant: NITTO DENKO CORPORATION

Inventor： Rihito FUKUSHIMA ,  Shusaku SHIBATA ,  Teppei NIINO

IPC: H05K1/18 ,  H05K3/32 ,  H05K1/09 ,  H05K1/05

Abstract: A wiring circuit board includes a mounting region for mounting an electronic element and a circuit region surrounding the mounting region. The mounting region includes a terminal. The circuit region includes a circuit to be electrically connected to the terminal. The circuit region includes a metal support layer, a base insulating layer, and a conductive layer including the circuit. The mounting region does not include the metal support layer and includes a base insulating layer having an opening portion, and the conductive layer including the terminal. The terminal is disposed in the opening portion of the base insulating layer.

公开(公告)号：US20220386458A1

公开(公告)日：2022-12-01

申请号：US17775789

申请日：2020-10-12

Applicant: NITTO DENKO CORPORATION

Inventor： Rihito FUKUSHIMA ,  Shusaku SHIBATA

IPC: H05K1/02

Abstract: A wiring circuit board includes a base insulating layer, a first wiring layer disposed at one side in a thickness direction of the base insulating layer, and a cover insulating layer disposed on one surface in the thickness direction of the base insulating layer so as to cover the first wiring layer. The first wiring layer includes a first wiring portion in contact with one surface of the base insulating layer, and a second wiring portion in contact with one surface in the thickness direction of the first wiring portion. Both end surfaces in a width direction perpendicular to the thickness direction and a transmission direction of the second wiring portion are disposed inside in the width direction with respect to both end surfaces of the first wiring portion.

公开(公告)号：US20220007507A1

公开(公告)日：2022-01-06

申请号：US17296805

申请日：2019-10-28

Applicant: NITTO DENKO CORPORATION

Inventor： Rihito FUKUSHIMA ,  Hayato TAKAKURA ,  Shuichi WAKAKI

IPC: H05K1/11 ,  H05K3/20

Abstract: A wiring circuit board includes a base insulating layer, a conductive layer, and a metal protective film in order toward one side in a thickness direction. The conductive layer includes a signal wiring and a terminal continuous therewith. The signal wiring has one surface in the thickness direction, and first and second surfaces continuous with the one surface and disposed to face each other in a width direction. The terminal has one surface in the thickness direction, and the other surface disposed to face the one surface at the other side in the thickness direction at spaced intervals thereto. The other surface of the terminal is exposed from the base insulating layer toward the other side in the thickness direction. The metal protective film covers the one surface of the signal wiring and one surface of the terminal but not both first or second surfaces.