公开(公告)号：US20190092382A1

公开(公告)日：2019-03-28

申请号：US16080061

申请日：2017-03-02

Applicant: NSK LTD.

Inventor： Teruyoshi KOGURE ,  Shigeru SHIMAKAWA ,  Shin KUMAGAI ,  Ryoichi SUZUKI

IPC: B62D5/04 ,  H02P6/08 ,  H02P6/28 ,  H02P23/14

Abstract: A motor control unit that is connected to a motor release switch which includes FETs and is disposed between an inverter and a motor, including: a control section to detect an assist state of the inverter, to turn-ON or turn-OFF a control of the inverter based on a detection result and to detect whether abnormality is existed or not; a motor rotational speed detecting section to detect a motor rotational speed; an energy calculating section to calculate an energy based on the motor rotational speed; a judging section to turn-OFF all of the FETs of the motor release switch when the energy is within an area of safety operation; and a state detecting section to detect whether abnormality is existed or not based on information from an abnormality detecting section that detects abnormality of the sensors and the inverter, wherein the control section turns-ON the control of the inverter when the state detecting section does not detect abnormality and turns-OFF the control of the inverter when the state detecting section detects abnormality.

公开(公告)号：US20170309555A1

公开(公告)日：2017-10-26

申请号：US15516730

申请日：2015-11-20

Applicant: NSK LTD.

Inventor： Shigeru SHIMAKAWA ,  Takashi SUNAGA ,  Takaaki SEKINE ,  Teruyoshi KOGURE ,  Ryoichi SUZUKI

IPC: H01L23/495 ,  H05K7/20 ,  H02K11/33 ,  H01L21/48 ,  H01C1/14 ,  B62D5/04 ,  H01L21/56

CPC classification number: H01L23/49568 ,  B62D5/0403 ,  B62D5/0406 ,  B62D5/0409 ,  H01C1/14 ,  H01L21/4821 ,  H01L21/565 ,  H01L23/3735 ,  H01L23/48 ,  H01L23/49524 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49589 ,  H01L23/49861 ,  H01L24/37 ,  H01L24/40 ,  H01L25/072 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/40 ,  H01L2224/40245 ,  H01L2924/0002 ,  H01L2924/18301 ,  H02K11/33 ,  H05K7/2089 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: [Problem] An object of the present invention is to provide an electronic part mounting heat-dissipating substrate which enables a circuit for which a power semiconductor in which a large current flows is used to reduce the wiring resistances of a large power operation and improve the heat dissipation.[Means for Solving] The present invention is an electronic part mounting heat-dissipating substrate which comprises lead frames of wiring pattern shapes formed by conductor plate and an insulating member 130 which is provided between the lead frames 110, wherein a plate surface of a part arrangement surface of said conductor plate and a top surface of said insulating member at a side of said part arrangement surface form one continuous surface, the lead frames have different thicknesses, the thick lead frame 110H is used for a large current signal and the thin lead frame 110L is used for a small current signal, a plate surface of a back surface of the part arrangement surface and a top surface of the insulating member at a side of the back surface at the part arrangement surface-side are formed in an identical plane.

公开(公告)号：US20170294374A1

公开(公告)日：2017-10-12

申请号：US15516723

申请日：2015-11-20

Applicant: NSK Ltd.

Inventor： Shigeru SIMAKAWA ,  Takashi SUNAGA ,  Takaaki SEKINE ,  Teruyoshi KOGURE ,  Ryoichi SUZUKI

IPC: H01L23/50 ,  H01L23/36 ,  H01L23/12 ,  H01L23/00

CPC classification number: H01L23/50 ,  B29C39/10 ,  B62D5/0406 ,  G01R1/203 ,  H01L23/12 ,  H01L23/36 ,  H01L23/367 ,  H01L23/48 ,  H01L23/49844 ,  H01L23/49861 ,  H01L24/40 ,  H01L25/072 ,  H01L2924/0002 ,  H02K11/33 ,  H02M7/003 ,  H02M2001/327 ,  H01L2924/00

Abstract: An electronic part mounting heat-dissipating substrate which includes: a conductor plate which is formed on lead frames of wiring pattern shapes; and an insulating member which is provided between the lead frames of the wiring pattern shapes on the conductor plate; wherein a plate surface of a part arrangement surface of the conductor plate and a top surface of the insulating member at a side of the part arrangement surface form one continuous surface, wherein a plate surface of a back surface of the part arrangement surface of the conductor plate and a top surface of the insulating member at a side of the back surface at the part arrangement surface-side are formed in an identical plane, wherein the substrate is formed in a circular shape

公开(公告)号：US20180154931A1

公开(公告)日：2018-06-07

申请号：US15317572

申请日：2015-05-08

Applicant: NSK Ltd.

Inventor： Naoto SHINKAWA ,  Shigeru FUKINUKI ,  Shin KUMAGAI ,  Shigeru SHIMAKAWA ,  Teruyoshi KOGURE

IPC: B62D5/04 ,  H02P27/08 ,  H02P29/68

CPC classification number: B62D5/0484 ,  B62D5/046 ,  B62D5/0481 ,  B62D5/0496 ,  H02P27/08 ,  H02P29/68

Abstract: [Problem]An object of the present invention is to provide a motor control apparatus that, with a high reliability, protects the motor release-switch comprising the semiconductor switching elements in small size and an electric power steering apparatus provided the same.[Means for solving the problem]An electric power steering apparatus that drive-controls a motor by an inverter, and a motor release-switch is connected between the inverter and the motor, comprising: a control section to detect an assist state on a driving control system and to ON/OFF-switch a control of the inverter based on a detection result; a motor rotational number detecting section to detect a rotational number of the motor; an energy calculating section to calculate an energy of a motor back-EMF and a regenerative current based on the rotational number; and a judging section to compare the energy with an area of safety operation of the motor release-switch and to OFF-switch the d motor release-switch when the energy becomes within the area of safety operation. As occasion demands, the area of safety operation is calculated with the temperature.

公开(公告)号：US20170309556A1

公开(公告)日：2017-10-26

申请号：US15523478

申请日：2015-11-20

Applicant: NSK Ltd.

Inventor： Shigeru SHIMAKAWA ,  Takashi SUNAGA ,  Takaaki SEKINE ,  Teruyoshi KOGURE ,  Ryoichi SUZUKI

IPC: H01L23/495 ,  H01L49/02

CPC classification number: H01L23/49568 ,  B62D5/0406 ,  G01R1/203 ,  H01L23/12 ,  H01L23/36 ,  H01L23/48 ,  H01L23/49524 ,  H01L23/49531 ,  H01L23/49537 ,  H01L23/49558 ,  H01L23/49861 ,  H01L23/50 ,  H01L24/34 ,  H01L24/37 ,  H01L25/071 ,  H01L28/20 ,  H01L2224/34 ,  H01L2224/37147 ,  H01L2224/37599 ,  H02K11/33 ,  H05K1/181 ,  H05K3/202 ,  H05K2201/09881 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An electronic heat-dissipating substrate including: lead frames of wiring pattern shapes on a conductor plate; and an insulating member between the lead frames. A plate surface of the lead frames and a top surface of the insulating member form one continuous surface. The part arrangement surface is on both surfaces of the electronic part mounting heat-dissipating substrate, a reductant circuit which includes at least similar dual-system circuit is formed on the electronic part mounting heat-dissipating substrate, a first-system circuit of the dual-system circuit is formed on a first surface of the electronic part mounting heat-dissipating substrate, a second-system circuit of the dual-system circuit is formed on a second surface of the electronic part mounting heat-dissipating substrate, and the common lead frames used in a portion of a circuit wiring are used to the first surface and the second surface of the electronic part mounting heat-dissipating substrate.