公开(公告)号：US10039187B2

公开(公告)日：2018-07-31

申请号：US15561457

申请日：2016-03-17

Applicant: NTT ELECTRONICS CORPORATION

Inventor： Kazumasa Yoshida ,  Toshiyuki Ozawa ,  Teruaki Sato ,  Atsushi Tomita ,  Yosuke Takeuchi ,  Shinji Mino ,  Yusuke Nasu

IPC: H05K3/36 ,  H05K3/40 ,  H05K1/14 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/147 ,  H05K1/02 ,  H05K1/0237 ,  H05K1/028 ,  H05K1/115 ,  H05K3/363 ,  H05K2201/09027 ,  H05K2201/10189

Abstract: A flexible substrate having a branch structure in the related art has problems in that: adhesive strength after two bodies are folded and fixed at a bonding region decreases due to an unfolding and opening force at a curve portion and ends of the bonded portions are peeled off and generate gaps; and in a soldering process of the two bodies, the electrodes of one body soldered first are displaced due to reheating in soldering the other body secondly and deteriorate in soldered connection. The present invention provides a new flexible substrate having a branch structure, including first and second bodies joined together, and having a structure in which one of the bodies can be folded back in a longitudinal direction of the whole flexible substrate. Tip ends of the two bodies are provided with multiple electrodes, and are connected by soldering to approximately corresponding positions on both surfaces of an end portion of a printed substrate concerned.