Abstract:
The present invention provides a rear cover of a flat panel electronic device and a flat panel electronic device having the rear cover. A outer surface of the rear cover is provided with a recess and a supporting leg, the supporting leg is pivotably connected in the recess through a pivot means so as to enable the supporting leg to pivot between a retracting position and an unfolding position, the supporting leg is configured to be contained in the recess when being in the retracting position, and to make an angle with the rear cover when being in the unfolding position, a speaker is disposed in the supporting leg, sound holes are disposed at a position on a side wall of the supporting leg which is corresponding to the speaker, a through-hole is formed at a position of the rear cover which is corresponding to the pivot means, and an electric wire of the speaker passes through the through-hole to extend into the rear cover. The angle of the screen of the flat panel electronic device relative to the user can be adjusted through the supporting leg of the rear cover to improve the user's comfort level in watching, and the surface to be placed (such as the table surface) has no influence on the sound effect.
Abstract:
According to various embodiments, a printed circuit board includes: a buried via formed through one or more layers of the printed circuit board; a first conductive pad that is formed on a first end of the buried via; a first conductive via that is formed through a first layer of the printed circuit board and is connected to the first conductive pad; and a second conductive via that is formed through the first layer of the printed circuit board and is connected to the first conductive pad.
Abstract:
A method for forming a printed circuit board includes: forming on a substrate a first conductive layer for a first edge connector pin and a first conductive layer for a second edge connector pin, wherein the first conductive layer for the first edge connector pin and the first conductive layer for the second edge connector pin are electrically coupled to one another via a first conductive layer for an electrical bridging element; electroplating a second conductive layer onto both the first conductive layer for the first edge connector pin and the first conductive layer for the second edge connector pin via a plating current conductor; and removing at least a portion of the electrical bridging element to electrically separate the first edge connector pin from the second edge connector pin.
Abstract:
A method for forming a printed circuit board includes: forming on a substrate a first conductive layer for a first edge connector pin and a first conductive layer for a second edge connector pin, wherein the first conductive layer for the first edge connector pin and the first conductive layer for the second edge connector pin are electrically coupled to one another via a first conductive layer for an electrical bridging element; electroplating a second conductive layer onto both the first conductive layer for the first edge connector pin and the first conductive layer for the second edge connector pin via a plating current conductor; and removing at least a portion of the electrical bridging element to electrically separate the first edge connector pin from the second edge connector pin.
Abstract:
A printed circuit board includes a first voltage plane disposed on a first surface of a first electrically insulating layer and a second voltage plane. An inter-layer slot that is formed through the first electrically insulating layer and includes an electrically conductive material electrically couples the first voltage plane to the second voltage plane.