公开(公告)号：US20240260191A1

公开(公告)日：2024-08-01

申请号：US17923193

申请日：2022-07-27

Applicant: NVIDIA CORPORATION

Inventor： Sien CHEN ,  Xuan WANG ,  Ziyi XU

IPC: H05K1/14 ,  H05K1/02 ,  H05K7/20

CPC classification number: H05K1/144 ,  H05K1/0203 ,  H05K7/20154 ,  H05K2201/041 ,  H05K2201/10545 ,  H05K2201/10734

Abstract: According to various embodiments, a processing subsystem includes a first printed circuit board (PCB); a processor mounted directly on a first side of the first PCB; and one or more power components. The one or more power components are coupled to a second side of the first PCB and electrically coupled to the processor, where the first side of the first PCB is opposite to the second side of the first PCB.