-
公开(公告)号：US20250048532A1
公开(公告)日：2025-02-06
申请号：US18919701
申请日：2024-10-18
Applicant: NVIDIA Corp.
Inventor： Joey Cai , Tiger Yan , Zhu Hao , Yi Dinghai
IPC: H05K1/02
Abstract: A circuit board includes chip die mounted on a three dimensional rectangular structure, a three dimensional triangular prism structure, or a combination thereof. A ball grid array for the chip die mounted on any such three dimensional structure is interposed between the three dimensional structure and the circuit board itself.
-
公开(公告)号：US20230337350A1
公开(公告)日：2023-10-19
申请号：US17723172
申请日：2022-04-18
Applicant: NVIDIA Corp.
Inventor： Joey Cai , Tiger Yan , Zhu Hao , Yi Dinghai
IPC: H05K1/02
CPC classification number: H05K1/0203 , H05K2201/09227 , H05K2201/10734
Abstract: A circuit board includes chip die mounted on a three dimensional rectangular structure, a three dimensional triangular prism structure, or a combination thereof. A ball grid array for the chip die mounted on any such three dimensional structure is interposed between the three dimensional structure and the circuit board itself.
-
公开(公告)号：US11791319B2
公开(公告)日：2023-10-17
申请号：US17163918
申请日：2021-02-01
Applicant: NVIDIA Corp.
IPC: H01L25/10 , H01L23/498 , H01L25/00 , H01L23/367 , H01R12/70
CPC classification number: H01L25/105 , H01L23/367 , H01L23/49805 , H01L25/50 , H01R12/7076
Abstract: Edge-connected semiconductor systems are described along with methods of making and using the same. First and second integrated circuit packages are obtained, each including a substrate assembly having top and bottom sides and an edge that extends between the top and the bottom sides. Edge contacts are disposed on the edges of the substrate assemblies. A ganged assembly is formed by establishing conductive paths between the edge contacts of the substrate assemblies. The ganged assembly is coupled to a printed circuit board (“PCB”) by coupling host contacts on one or more of the substrate assemblies to corresponding contacts on the PCB.
-
公开(公告)号：US20220246589A1
公开(公告)日：2022-08-04
申请号：US17163918
申请日：2021-02-01
Applicant: NVIDIA Corp.
IPC: H01L25/10 , H01L23/498 , H01R12/70 , H01L23/367 , H01L25/00
Abstract: Edge-connected semiconductor systems are described along with methods of making and using the same. First and second integrated circuit packages are obtained, each including a substrate assembly having top and bottom sides and an edge that extends between the top and the bottom sides. Edge contacts are disposed on the edges of the substrate assemblies. A ganged assembly is formed by establishing conductive paths between the edge contacts of the substrate assemblies. The ganged assembly is coupled to a printed circuit board (“PCB”) by coupling host contacts on one or more of the substrate assemblies to corresponding contacts on the PCB.
-
-
-
Search Results
4
records
(took 0.01 seconds)
