公开(公告)号：US20230337350A1

公开(公告)日：2023-10-19

申请号：US17723172

申请日：2022-04-18

Applicant: NVIDIA Corp.

Inventor： Joey Cai ,  Tiger Yan ,  Zhu Hao ,  Yi Dinghai

IPC: H05K1/02

CPC classification number: H05K1/0203 ,  H05K2201/09227 ,  H05K2201/10734

Abstract: A circuit board includes chip die mounted on a three dimensional rectangular structure, a three dimensional triangular prism structure, or a combination thereof. A ball grid array for the chip die mounted on any such three dimensional structure is interposed between the three dimensional structure and the circuit board itself.

公开(公告)号：US20250048532A1

公开(公告)日：2025-02-06

申请号：US18919701

申请日：2024-10-18

Applicant: NVIDIA Corp.

Inventor： Joey Cai ,  Tiger Yan ,  Zhu Hao ,  Yi Dinghai

IPC: H05K1/02

Abstract: A circuit board includes chip die mounted on a three dimensional rectangular structure, a three dimensional triangular prism structure, or a combination thereof. A ball grid array for the chip die mounted on any such three dimensional structure is interposed between the three dimensional structure and the circuit board itself.