公开(公告)号：US08864500B1

公开(公告)日：2014-10-21

申请号：US13653254

申请日：2012-10-16

Applicant: Netlist, Inc.

Inventor： Jayesh R. Bhakta ,  Enchao Yu ,  Chi She Chen ,  Richard E. Flaig

IPC: H01R12/00

CPC classification number: H05K1/147 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/0203 ,  H05K1/141 ,  H05K3/4691 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2203/1572 ,  H01L2224/0401

Abstract: An electronic module for a computer system comprises a first circuit board having a plurality of edge connectors configured to releasably connect to electrical contacts of a computer system socket, a second circuit board having a plurality of contacts configured to connect with a plurality of electrical components, and a flexible portion having electrical conduits to provide electrical connection between the plurality of edge connectors and the plurality of contacts. The flexible portion further includes an electrically conductive layer extending across a region of the flexible portion. The electrically conductive layer is superposed with the electrical conduits and separated from electrical conduits by a dielectric layer.

Abstract translation: 一种用于计算机系统的电子模块，包括具有多个边缘连接器的第一电路板，所述多个边缘连接器被配置为可释放地连接到计算机系统插座的电触头，第二电路板具有被配置为与多个电气部件连接的多个触点， 以及具有电导管以在所述多个边缘连接器和所述多个触点之间提供电连接的柔性部分。 柔性部分还包括延伸穿过柔性部分的区域的导电层。 导电层与电导管叠合并通过电介质层与电导管分离。