公开(公告)号：US09497855B2

公开(公告)日：2016-11-15

申请号：US14838930

申请日：2015-08-28

Applicant: Northeastern University

Inventor： Asli Sirman ,  Ahmed Busnaina ,  Cihan Yilmaz ,  Jun Huang ,  Sivasubramanian Somu

IPC: H05K1/03 ,  H05K1/09 ,  B82Y40/00 ,  C25D13/04 ,  C25D13/12 ,  H05K1/02 ,  H01L21/02 ,  H01L29/06 ,  B82Y30/00

CPC classification number: C25D13/22 ,  B82Y30/00 ,  B82Y40/00 ,  C09D5/4407 ,  C09D5/4488 ,  C09D125/06 ,  C25D13/04 ,  C25D13/12 ,  C25D13/20 ,  H01L21/0243 ,  H01L21/0259 ,  H01L21/02628 ,  H01L29/0665 ,  H05K1/0213 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/1258 ,  Y10S977/882 ,  Y10S977/892

Abstract: A method for high rate assembly of nanoelements into two-dimensional void patterns on a non-conductive substrate surface utilizes an applied electric field to stabilize against forces resulting from pulling the substrate through the surface of a nanoelement suspension. The electric field contours emanating from a conductive layer in the substrate, covered by an insulating layer, are modified by a patterned photoresist layer, resulting in an increased driving force for nanoelements to migrate from a liquid suspension to voids on a patterned substrate having a non-conductive surface. The method can be used for the production of microscale and nanoscale circuits, sensors, and other electronic devices.

公开(公告)号：US20150322589A1

公开(公告)日：2015-11-12

申请号：US14410961

申请日：2013-07-01

Applicant: Northeastern University

Inventor： Ahmed Busnaina ,  Cihan Yilmaz ,  TaeHoon Kim ,  Sivasubramanian Somu

IPC: C25D13/18 ,  B23K31/00 ,  C25D13/22 ,  C25D13/02 ,  C25D13/12

CPC classification number: C25D13/18 ,  B23K31/00 ,  B81B2203/0361 ,  B81B2207/056 ,  B81C1/00111 ,  B81C2201/0187 ,  C25D3/48 ,  C25D5/02 ,  C25D13/02 ,  C25D13/12 ,  C25D13/22 ,  H01L21/2885 ,  H01L21/76879 ,  H01L21/76885 ,  H01L2221/1094

Abstract: A variety of homogeneous or layered hybrid nanostructures are fabricated by electric field-directed assembly of nanoelements. The nanoelements and the fabricated nanostructures can be conducting, semi-conducting, or insulating, or any combination thereof. Factors for enhancing the assembly process are identified, including optimization of the electric field and combined dielectrophoretic and electrophoretic forces to drive assembly. The fabrication methods are rapid and scalable. The resulting nano structures have electrical and optical properties that render them highly useful in nanoscale electronics, optics, and biosensors.

Abstract translation: 通过纳米元件的电场定向组装制造各种均匀或分层的混合纳米结构。 纳米元件和制造的纳米结构可以是导电，半导电或绝缘或其任何组合。 确定了增强组装过程的因素，包括优化电场和组合介电泳和驱动装配的电泳力。 制造方法是快速和可扩展的。 所得纳米结构具有电和光学性质，使得它们在纳米级电子学，光学和生物传感器中非常有用。

公开(公告)号：US11220756B2

公开(公告)日：2022-01-11

申请号：US16131658

申请日：2018-09-14

Applicant: Northeastern University

Inventor： Ahmed Busnaina ,  Cihan Yilmaz ,  TaeHoon Kim ,  Sivasubramanian Somu

IPC: C25D13/18 ,  C25D13/12 ,  C25D13/22 ,  C25D5/02 ,  C25D13/02 ,  C25D3/48 ,  B23K31/00 ,  B81C1/00 ,  H01L21/768 ,  H01L21/288

Abstract: A variety of homogeneous or layered hybrid nanostructures are fabricated by electric field-directed assembly of nanoelements. The nanoelements and the fabricated nanostructures can be conducting, semi-conducting, or insulating, or any combination thereof. Factors for enhancing the assembly process are identified, including optimization of the electric field and combined dielectrophoretic and electrophoretic forces to drive assembly. The fabrication methods are rapid and scalable. The resulting nanostructures have electrical and optical properties that render them highly useful in nanoscale electronics, optics, and biosensors.

公开(公告)号：US20190211467A1

公开(公告)日：2019-07-11

申请号：US16358324

申请日：2019-03-19

Applicant: Northeastern University

Inventor： Asli Sirman ,  Ahmed Busnaina ,  Cihan Yilmaz ,  Jun Huang ,  Sivasubramanian Somu

IPC: C25D13/22 ,  H05K1/09 ,  C25D13/04 ,  C09D5/44 ,  H05K3/12 ,  C25D13/20 ,  C09D125/06 ,  B82Y40/00 ,  H05K1/02 ,  C25D13/12 ,  H05K1/03

CPC classification number: C25D13/22 ,  B82Y30/00 ,  B82Y40/00 ,  C09D5/4407 ,  C09D5/4488 ,  C09D125/06 ,  C25D13/04 ,  C25D13/12 ,  C25D13/20 ,  H01L21/0243 ,  H01L21/0259 ,  H01L21/02628 ,  H01L29/0665 ,  H05K1/0213 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/1258 ,  Y10S977/882 ,  Y10S977/892

Abstract: A method for high rate assembly of nanoelements into two-dimensional void patterns on a non-conductive substrate surface utilizes an applied electric field to stabilize against forces resulting from pulling the substrate through the surface of a nanoelement suspension. The electric field contours emanating from a conductive layer in the substrate, covered by an insulating layer, are modified by a patterned photoresist layer, resulting in an increased driving force for nanoelements to migrate from a liquid suspension to voids on a patterned substrate having a non-conductive surface. The method can be used for the production of microscale and nanoscale circuits, sensors, and other electronic devices.

公开(公告)号：US09548242B2

公开(公告)日：2017-01-17

申请号：US14837227

申请日：2015-08-27

Applicant: Northeastern University

Inventor： Ahmed Busnaina ,  Cihan Yilmaz ,  TaeHoon Kim ,  Sivasubramanian Somu

IPC: H01L21/768 ,  H01L21/288 ,  H01L23/532 ,  C25D13/00 ,  H01L23/522 ,  B82Y10/00 ,  B82Y30/00

CPC classification number: H01L21/76879 ,  B82Y10/00 ,  B82Y30/00 ,  C25D13/00 ,  H01L21/2885 ,  H01L23/5226 ,  H01L23/53214 ,  H01L23/53228 ,  H01L23/53242 ,  H01L23/53257 ,  H01L23/53276 ,  H01L2221/1094 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The invention provides a fast, scalable, room temperature process for fabricating metallic nanorods from nanoparticles or fabricating metallic or semiconducting nanorods from carbon nanotubes suspended in an aqueous solution. The assembled nanorods are suitable for use as nanoscale interconnects in CMOS-based devices and sensors. Metallic nanoparticles or carbon nanotubes are assembled into lithographically patterned vias by applying an external electric field. Since the dimensions of nanorods are controlled by the dimensions of vias, the nanorod dimensions can be scaled down to the low nanometer range. The aqueous assembly process is environmentally friendly and can be used to make nanorods using different types of metallic particles as well as semiconducting and metallic nanotubes.

Abstract translation: 本发明提供了用于从纳米颗粒制造金属纳米棒的快速，可扩展的室温工艺，或者从悬浮在水溶液中的碳纳米管制造金属或半导体纳米棒。 组装的纳米棒适合用作基于CMOS的器件和传感器中的纳米级互连。 通过施加外部电场将金属纳米颗粒或碳纳米管组装成光刻图案化的通孔。 由于纳米棒的尺寸由通孔的尺寸控制，纳米棒尺寸可以缩小到低纳米范围。 水性组合方法是环境友好的，并且可以用于制备使用不同类型的金属颗粒以及半导体和金属纳米管的纳米棒。

公开(公告)号：US20150137371A1

公开(公告)日：2015-05-21

申请号：US14570020

申请日：2014-12-15

Applicant: Northeastern University

Inventor： Ahmed Busnaina ,  Cihan Yilmaz ,  TaeHoon Kim ,  Sivasubramanian Somu

IPC: H01L23/532 ,  C25D13/00 ,  H01L21/768

CPC classification number: H01L21/76879 ,  B82Y10/00 ,  B82Y30/00 ,  C25D13/00 ,  H01L21/2885 ,  H01L23/5226 ,  H01L23/53214 ,  H01L23/53228 ,  H01L23/53242 ,  H01L23/53257 ,  H01L23/53276 ,  H01L2221/1094 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The invention provides a fast, scalable, room temperature process for fabricating metallic nanorods from nanoparticles or fabricating metallic or semiconducting nanorods from carbon nanotubes suspended in an aqueous solution. The assembled nanorods are suitable for use as nanoscale interconnects in CMOS-based devices and sensors. Metallic nanoparticles or carbon nanotubes are assembled into lithographically patterned vias by applying an external electric field. Since the dimensions of nanorods are controlled by the dimensions of vias, the nanorod dimensions can be scaled down to the low nanometer range. The aqueous assembly process is environmentally friendly and can be used to make nanorods using different types of metallic particles as well as semiconducting and metallic nanotubes.

公开(公告)号：US10233559B2

公开(公告)日：2019-03-19

申请号：US15350636

申请日：2016-11-14

Applicant: Northeastern University

Inventor： Asli Sirman ,  Ahmed Busnaina ,  Cihan Yilmaz ,  Jun Huang ,  Sivasubramanian Somu

IPC: C25D13/22 ,  H05K1/03 ,  H05K1/09 ,  H05K3/12 ,  C25D13/12 ,  C25D13/04 ,  C25D13/20 ,  C09D5/44 ,  C09D125/06 ,  B82Y40/00 ,  H05K1/02 ,  H01L21/02 ,  H01L29/06 ,  B82Y30/00

Abstract: A method for high rate assembly of nanoelements into two-dimensional void patterns on a non-conductive substrate surface utilizes an applied electric field to stabilize against forces resulting from pulling the substrate through the surface of a nanoelement suspension. The electric field contours emanating from a conductive layer in the substrate, covered by an insulating layer, are modified by a patterned photoresist layer, resulting in an increased driving force for nanoelements to migrate from a liquid suspension to voids on a patterned substrate having a non-conductive surface. The method can be used for the production of microscale and nanoscale circuits, sensors, and other electronic devices.

公开(公告)号：US20150371900A1

公开(公告)日：2015-12-24

申请号：US14837227

申请日：2015-08-27

Applicant: Northeastern University

Inventor： Ahmed Busnaina ,  Cihan Yilmaz ,  TaeHoon Kim ,  Sivasubramanian Somu

IPC: H01L21/768 ,  H01L23/532 ,  H01L23/522

CPC classification number: H01L21/76879 ,  B82Y10/00 ,  B82Y30/00 ,  C25D13/00 ,  H01L21/2885 ,  H01L23/5226 ,  H01L23/53214 ,  H01L23/53228 ,  H01L23/53242 ,  H01L23/53257 ,  H01L23/53276 ,  H01L2221/1094 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The invention provides a fast, scalable, room temperature process for fabricating metallic nanorods from nanoparticles or fabricating metallic or semiconducting nanorods from carbon nanotubes suspended in an aqueous solution. The assembled nanorods are suitable for use as nanoscale interconnects in CMOS-based devices and sensors. Metallic nanoparticles or carbon nanotubes are assembled into lithographically patterned vias by applying an external electric field. Since the dimensions of nanorods are controlled by the dimensions of vias, the nanorod dimensions can be scaled down to the low nanometer range. The aqueous assembly process is environmentally friendly and can be used to make nanorods using different types of metallic particles as well as semiconducting and metallic nanotubes.

Abstract translation: 本发明提供了用于从纳米颗粒制造金属纳米棒的快速，可扩展的室温工艺，或者从悬浮在水溶液中的碳纳米管制造金属或半导体纳米棒。 组装的纳米棒适合用作基于CMOS的器件和传感器中的纳米级互连。 通过施加外部电场将金属纳米颗粒或碳纳米管组装成光刻图案化的通孔。 由于纳米棒的尺寸由通孔的尺寸控制，纳米棒尺寸可以缩小到低纳米范围。 水性组合方法是环境友好的，并且可以用于制备使用不同类型的金属颗粒以及半导体和金属纳米管的纳米棒。

公开(公告)号：US20140227722A1

公开(公告)日：2014-08-14

申请号：US14201006

申请日：2014-03-07

Applicant: Northeastern University

Inventor： Asanterabi Malima ,  Ahmed Busnaina ,  Salome Siavoshi ,  Sivasubramanian Somu ,  Cihan Yilmaz ,  Tiziana Musacchio ,  Jaydev Upponi ,  Vladimir Torchilin

IPC: G01N33/574

CPC classification number: G01N33/574 ,  G01N33/5438 ,  Y10T428/2457 ,  Y10T428/24612 ,  Y10T428/24942

Abstract: Nanosubstrates as biosensors, methods of making such nanosubstrates, and methods of using such nanosubstrates to detect biomarkers are described.

Abstract translation: 描述了作为生物传感器的纳米基质，制备这种纳米基质的方法，以及使用这种纳米基质来检测生物标志物的方法。

公开(公告)号：US20170058422A1

公开(公告)日：2017-03-02

申请号：US15350636

申请日：2016-11-14

Applicant: Northeastern University

Inventor： Asli Sirman ,  Ahmed Busnaina ,  Cihan Yilmaz ,  Jun Huang ,  Sivasubramanian Somu

IPC: C25D13/22 ,  H05K1/09 ,  H05K3/12 ,  C09D125/06 ,  C25D13/04 ,  C25D13/20 ,  C09D5/44 ,  H05K1/03 ,  C25D13/12

CPC classification number: C25D13/22 ,  B82Y30/00 ,  B82Y40/00 ,  C09D5/4407 ,  C09D5/4488 ,  C09D125/06 ,  C25D13/04 ,  C25D13/12 ,  C25D13/20 ,  H01L21/0243 ,  H01L21/0259 ,  H01L21/02628 ,  H01L29/0665 ,  H05K1/0213 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/1258 ,  Y10S977/882 ,  Y10S977/892

Abstract: A method for high rate assembly of nanoelements into two-dimensional void patterns on a non-conductive substrate surface utilizes an applied electric field to stabilize against forces resulting from pulling the substrate through the surface of a nanoelement suspension. The electric field contours emanating from a conductive layer in the substrate, covered by an insulating layer, are modified by a patterned photoresist layer, resulting in an increased driving force for nanoelements to migrate from a liquid suspension to voids on a patterned substrate having a non-conductive surface. The method can be used for the production of microscale and nanoscale circuits, sensors, and other electronic devices.

Abstract translation: 将纳米元件高速组装成非导电基底表面上的二维空穴图案的方法利用施加的电场来抵抗通过纳米元素悬浮液的表面拉动基底所产生的力。 由绝缘层覆盖的衬底中的导电层发出的电场轮廓由图案化的光致抗蚀剂层改变，导致纳米元件从液体悬浮液迁移到具有非绝缘层的图案化衬底上的空隙的驱动力增加， 导电表面。 该方法可用于生产微尺度和纳米级电路，传感器和其他电子设备。