公开(公告)号：US20240222302A1

公开(公告)日：2024-07-04

申请号：US18552746

申请日：2021-07-19

Applicant: ORBOTECH LTD.

Inventor： Zvi KOTLER ,  Ofer FOGEL ,  Sharona COHEN ,  Gil BERNSTEIN TOKER ,  Niv GORODESKY

IPC: H01L23/00 ,  B23K1/00 ,  B23K1/005 ,  B23K3/047 ,  B23K3/06 ,  B23K3/08 ,  B23K101/40 ,  H01L21/66

CPC classification number: H01L24/11 ,  B23K1/0016 ,  B23K1/0056 ,  B23K3/047 ,  B23K3/0638 ,  B23K3/08 ,  H01L22/20 ,  H01L24/742 ,  B23K2101/40 ,  H01L2224/11318 ,  H01L2224/1183 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/742

Abstract: A method for circuit fabrication includes inspecting an array of solder bumps on a circuit substrate so as to identify a solder bump having a height above the substrate that is greater than a predefined maximum. A first laser beam is directed toward the identified solder bump so as to ablate a selected amount of a solder material from the identified solder bump. Alternatively or additionally, a further solder bump having a height above the substrate that is less than a predefined minimum is identified, and one or more molten droplets of the solder material are deposited on the further solder bump. After ablating or depositing the solder material, a second laser beam is directed toward the identified solder bump with sufficient energy to cause the solder material in the identified solder bump to melt and reflow.