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公开(公告)号：US20240222302A1
公开(公告)日：2024-07-04
申请号：US18552746
申请日：2021-07-19
Applicant: ORBOTECH LTD.
Inventor： Zvi KOTLER , Ofer FOGEL , Sharona COHEN , Gil BERNSTEIN TOKER , Niv GORODESKY
CPC classification number: H01L24/11 , B23K1/0016 , B23K1/0056 , B23K3/047 , B23K3/0638 , B23K3/08 , H01L22/20 , H01L24/742 , B23K2101/40 , H01L2224/11318 , H01L2224/1183 , H01L2224/11849 , H01L2224/11901 , H01L2224/742
Abstract: A method for circuit fabrication includes inspecting an array of solder bumps on a circuit substrate so as to identify a solder bump having a height above the substrate that is greater than a predefined maximum. A first laser beam is directed toward the identified solder bump so as to ablate a selected amount of a solder material from the identified solder bump. Alternatively or additionally, a further solder bump having a height above the substrate that is less than a predefined minimum is identified, and one or more molten droplets of the solder material are deposited on the further solder bump. After ablating or depositing the solder material, a second laser beam is directed toward the identified solder bump with sufficient energy to cause the solder material in the identified solder bump to melt and reflow.
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Patent Agency Ranking
公开(公告)号：US20220347778A1
公开(公告)日：2022-11-03
申请号：US17422169
申请日：2021-03-17
Applicant: Orbotech Ltd.
Inventor： Jonathan ANKRI , Zvi KOTLER
Abstract: A method for fabrication includes providing a donor sheet, including a donor substrate, which is transparent in a specified spectral range, a sacrificial layer, which absorbs optical radiation within the specified spectral range and is disposed over the donor substrate, and a donor film, which includes a paste and is disposed over the sacrificial layer. The donor sheet is positioned so that the donor film is in proximity to a target location on an acceptor substrate. A pulsed laser beam impinges on the sacrificial layer with a pulse energy and spot size selected so as to ablate the sacrificial layer, thus causing a viscoelastic jet of the paste to be ejected from the donor film and to deposit, at the target location on the acceptor substrate, a dot having a diameter less than the spot size of the laser beam.
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公开(公告)号：US20160233089A1
公开(公告)日：2016-08-11
申请号：US15024674
申请日：2014-10-07
Applicant: Orbotech Ltd.
Inventor： Michael ZENOU , Zvi KOTLER
CPC classification number: H01L21/268 , B33Y10/00 , B33Y30/00 , B41M5/025 , B41M2205/08 , C23C26/02 , H01G7/021 , H01G7/026 , H01L21/02601 , H01L21/02612 , H01L21/288 , H05K3/1241 , H05K3/225
Abstract: A method for material deposition includes providing a transparent donor substrate (56, 60) having opposing first and second surfaces and multiple donor films (62, 64) including different, respective materials on the second surface. The donor substrate is positioned in proximity to an acceptor substrate (41), with the second surface facing toward the acceptor substrate. Pulses of laser radiation are directed to pass through the first surface of the donor substrate and impinge on the donor films so as to induce ejection of molten droplets containing a bulk mixture of the different materials from the donor films onto the acceptor substrate.
Abstract translation: 一种用于材料沉积的方法包括提供具有相对的第一和第二表面的透明施主衬底（56,60）和在第二表面上包括不同相应材料的多个施主膜（62,64）。 施主衬底位于受体衬底（41）附近，第二表面朝向受主衬底。 激光辐射的脉冲被引导通过供体衬底的第一表面并撞击施主膜，以便将包含不同材料的主体混合物的熔融液滴从施主膜喷射到受体衬底上。
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公开(公告)号：US20150033557A1
公开(公告)日：2015-02-05
申请号：US13958043
申请日：2013-08-02
Applicant: Orbotech Ltd.
Inventor： Zvi KOTLER , Michael ZENOU
CPC classification number: H05K3/027 , H05K1/095 , H05K1/097 , H05K3/0008 , H05K3/1241 , H05K3/125 , H05K3/1283 , H05K3/225 , H05K3/26 , H05K2201/026 , H05K2201/0323 , H05K2203/081 , H05K2203/108 , H05K2203/173 , Y10T29/49156 , Y10T29/49163 , Y10T29/53243
Abstract: A method of producing a conductive path on a substrate including depositing on the substrate a layer of material having a thickness in the range of 0.1 to 5 microns, including metal particles having a diameter in the range of 10 to 100 nanometers, employing a patterning laser beam to selectably sinter regions of the layer of material, thereby causing the metal particles to together define a conductor at sintered regions and employing an ablating laser beam, below a threshold at which the sintered regions would be ablated, to ablate portions of the layer of material other than at the sintered regions.
Abstract translation: 一种在衬底上制造导电路径的方法，包括在衬底上沉积厚度在0.1至5微米范围内的材料层，其中包括直径在10至100纳米范围内的直径在10至100纳米范围内的金属颗粒，采用图案化激光 光束可选择地烧结材料层的区域，从而使金属颗粒在烧结区域处一起限定导体，并采用低于烧结区域将被烧蚀的阈值以下的烧蚀激光束来烧蚀部分 除烧结区以外的材料。
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公开(公告)号：US20210195756A1
公开(公告)日：2021-06-24
申请号：US17174337
申请日：2021-02-11
Applicant: Orbotech Ltd.
Inventor： Zvi KOTLER , Michael ZENOU
Abstract: A method of producing a conductive path on a substrate including depositing on the substrate a layer of material having a thickness in the range of 0.1 to 5 microns, including metal particles having a diameter in the range of 10 to 100 nanometers, employing a patterning laser beam to selectably sinter regions of the layer of material, thereby causing the metal particles to together define a conductor at sintered regions and employing an ablating laser beam, below a threshold at which the sintered regions would be ablated, to ablate portions of the layer of material other than at the sintered regions.
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公开(公告)号：US20170336697A1
公开(公告)日：2017-11-23
申请号：US15524282
申请日：2015-11-05
Applicant: Orbotech Ltd.
Inventor： Itay PELED , Zvi KOTLER , Ronald KAMINSKY
IPC: G02F1/33
Abstract: Optical apparatus includes an acousto-optic medium and an array of multiple piezoelectric transducers attached to the acousto-optic medium. A drive circuit is coupled to apply to the piezoelectric transducers respective drive signals including at least first and second frequency components at different, respective first and second frequencies and with different, respective phase offsets for the first and second frequency components at each of the multiple piezoelectric transducers.
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