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公开(公告)号:US20210249259A1
公开(公告)日:2021-08-12
申请号:US17241522
申请日:2021-04-27
Applicant: ORGANO CORPORATION
Inventor: Daisaku YANO , Yukinari YAMASHITA , Masami MURAYAMA , Koji YAMANAKA
Abstract: Provided are a substrate treatment method and a substrate treatment equipment enabling greater suppression of corrosion or oxidation of metal wiring exposed on a substrate surface. The present invention relates to a substrate treatment equipment having a treatment chamber wherein a substrate is disposed, and whereto a substrate treatment solution for treating the substrate is supplied. This equipment is provided with an inert gas filling mechanism for filling with an inert gas the interior of the treatment chamber wherein the substrate is disposed, and, near or inside the treatment chamber, a catalytic unit filled with a platinum-group metal catalyst wherethrough a hydrogen-dissolved water including hydrogen added to ultra-pure water is passed. Obtained by passing the hydrogen-dissolved water through the platinum-group metal catalyst, a hydrogen-dissolved treatment solution is supplied as the substrate treatment solution into the treatment chamber by the equipment.
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公开(公告)号:US20190381539A1
公开(公告)日:2019-12-19
申请号:US16556633
申请日:2019-08-30
Applicant: ORGANO CORPORATION
Inventor: Daisaku YANO , Masami MURAYAMA , Yukinari YAMASHITA , Koji YAMANAKA
Abstract: The water outlet of a subsystem that includes an ultraviolet oxidation device and the water inlet of each substrate treatment device are connected to each other via a main pipe. A hydrogen peroxide removal device is installed between the ultraviolet oxidation device of the subsystem and a non-regenerative ion-exchange device. In addition, a carbon dioxide supply device is installed at the middle of a pipe that branches from the water outlet of the subsystem to reach the substrate treatment device. According to an aspect, the hydrogen peroxide removal device is filled with a platinum-group metal catalyst. Thus, ultrapure water passed through the ultraviolet oxidation device is used as a base to produce carbonated water in which the concentration of hydrogen peroxide dissolved therein is limited to 2 μg/L or less and to which carbon dioxide is added to adjust resistivity to be within the range of 0.03 to 5.0 MΩ·cm.
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3.
公开(公告)号:US20160233082A1
公开(公告)日:2016-08-11
申请号:US15023161
申请日:2014-09-17
Applicant: ORGANO CORPORATION
Inventor: Daisaku YANO , Yukinari YAMASHITA , Masami MURAYAMA , Koji YAMANAKA
IPC: H01L21/02 , B08B3/08 , C02F9/00 , C02F1/68 , C23F1/16 , C02F1/20 , C02F1/70 , B01J19/24 , C11D7/08 , H01L21/67 , C02F1/44
CPC classification number: H01L21/02068 , C02F1/20 , C02F9/00 , C23G1/24 , C23G5/00 , H01L21/02071 , H01L21/67017 , H01L21/67051 , H01L21/6708 , H01L21/67086
Abstract: Provided are a substrate treatment method and a substrate treatment equipment enabling greater suppression of corrosion or oxidation of metal wiring exposed on a substrate surface. The present invention relates to a substrate treatment equipment having a treatment chamber wherein a substrate is disposed, and whereto a substrate treatment solution for treating the substrate is supplied. This equipment is provided with an inert gas filling mechanism for filling with an inert gas the interior of the treatment chamber wherein the substrate is disposed, and, near or inside the treatment chamber, a catalytic unit filled with a platinum-group metal catalyst wherethrough a hydrogen-dissolved water including hydrogen added to ultra-pure water is passed. Obtained by passing the hydrogen-dissolved water through the platinum-group metal catalyst, a hydrogen-dissolved treatment solution is supplied as the substrate treatment solution into the treatment chamber by the equipment.
Abstract translation: 提供了能够更好地抑制暴露在基板表面上的金属配线的腐蚀或氧化的基板处理方法和基板处理设备。 本发明涉及具有处理室的基板处理设备,其中设置有基板,并且提供用于处理基板的基板处理溶液。 该设备设置有惰性气体填充机构,用于在其中设置基板的处理室的内部填充惰性气体,并且在处理室的附近或内部,填充有铂族金属催化剂的催化单元,其中通过 包含加入超纯水中的氢的氢溶解水通过。 通过使氢溶解的水通过铂族金属催化剂而获得,通过设备将作为基板处理溶液的氢溶解处理液供给到处理室。
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4.
公开(公告)号:US20160059273A1
公开(公告)日:2016-03-03
申请号:US14783253
申请日:2014-04-17
Applicant: ORGANO CORPORATION
Inventor: Daisaku YANO , Masami MURAYAMA , Yukinari YAMASHITA , Koji YAMANAKA
CPC classification number: B08B3/08 , C02F1/20 , C02F1/32 , C02F1/42 , C02F1/44 , C02F1/68 , C02F9/00 , C02F2103/04 , C11D7/02 , C23G1/103 , C23G1/20 , H01L21/02068 , H01L21/6704
Abstract: The water outlet of a subsystem that includes an ultraviolet oxidation device and the water inlet of each substrate treatment device are connected to each other via a main pipe. A hydrogen peroxide removal device is installed between the ultraviolet oxidation device of the subsystem and a non-regenerative ion-exchange device. In addition, a carbon dioxide supply device is installed at the middle of a pipe that branches from the water outlet of the subsystem to reach the substrate treatment device. According to an aspect, the hydrogen peroxide removal device is filled with a platinum-group metal catalyst. Thus, ultrapure water passed through the ultraviolet oxidation device is used as a base to produce carbonated water in which the concentration of hydrogen peroxide dissolved therein is limited to 2 μg/L or less and to which carbon dioxide is added to adjust resistivity to be within the range of 0.03 to 5.0 MΩ·cm.
Abstract translation: 包括紫外线氧化装置和每个基板处理装置的进水口的子系统的出水口通过主管相互连接。 在子系统的紫外氧化装置和非再生离子交换装置之间安装过氧化氢去除装置。 此外,二氧化碳供应装置安装在从子系统的出水口分支到达基板处理装置的管的中间。 根据一方面,用铂族金属催化剂填充过氧化氢去除装置。 因此,使用通过紫外线氧化装置的超纯水作为碱,生成其中溶解有过氧化氢的浓度限制在2μg/ L以下的碳酸水,并且添加二氧化碳以将电阻率调节在 范围为0.03至5.0 M&OHgr;·cm。
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