公开(公告)号：US10378711B2

公开(公告)日：2019-08-13

申请号：US15779537

申请日：2016-11-03

Applicant: OSRAM GmbH

Inventor： Krister Bergenek ,  Joerg Sorg

IPC: F21S41/141 ,  F21S41/14 ,  F21S45/47 ,  F21S41/16 ,  F21S41/675 ,  F21S41/657 ,  H01L33/50

Abstract: A light generating device, comprising: at least one light emitting diode having a semiconductor layer that emits a first primary light, and having a phosphor layer arranged on the semiconductor layer, and at least one laser for generating at least one laser beam composed of a second primary light, by means of which the phosphor layer is irradiatable, wherein the phosphor layer is configured for at least partly converting the first primary light into at least one first secondary light and for at least partly converting the second primary light into at least one second secondary light. The light generating device is configured to dynamically illuminate the phosphor layer by means of the second primary light.

公开(公告)号：US09653436B2

公开(公告)日：2017-05-16

申请号：US14899163

申请日：2014-06-12

Applicant: OSRAM GmbH

Inventor： Reiner Windisch ,  Krister Bergenek ,  Andreas Biebersdorf ,  Ralph Wirth

IPC: H01L25/075 ,  H01L33/50 ,  F21Y115/10 ,  F21Y113/13 ,  F21Y113/17

CPC classification number: H01L25/0753 ,  F21Y2113/13 ,  F21Y2113/17 ,  F21Y2115/10 ,  H01L33/504 ,  H01L33/507 ,  H01L2224/05554 ,  H01L2224/48137 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Various embodiments may relate to an LED module, including a number of first inherently unpackaged LED chips, which are in each case designed to emit light of a first color at a respective light emission area, and a number of second inherently unpackaged LED chips, which are in each case designed to emit light of a second color, different than the first color, at a respective light emission area. The LED chips are provided jointly in a housing, and the respective light emission area of a second LED chip is at least 25% smaller than the respective light emission area of a first LED chip. The sum of the light emission areas of the first LED chips is at least 50% greater than the sum of the light emission areas of the second LED chips.

公开(公告)号：US09380652B2

公开(公告)日：2016-06-28

申请号：US13866052

申请日：2013-04-19

Applicant: OSRAM GmbH

Inventor： Krister Bergenek ,  Andreas Biebersdorf ,  Gertrud Kraeuter ,  Joerg Sorg ,  Reiner Windisch

IPC: H05B33/02 ,  H01L25/075 ,  H01L33/50 ,  H01L33/56

CPC classification number: H05B33/02 ,  H01L25/0753 ,  H01L33/505 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2933/0091 ,  H01L2924/00

Abstract: The lighting device has at least one LED chip that is potted by means of a potting compound, which potting compound has a light-transmissive, castable and curable matrix material comprising scattering volumes as filler material, wherein the scattering volumes are distributed inhomogeneously over a thickness of the potting compound and these scattering volumes have a lower density than the matrix material in its castable state. A method is used for producing a lighting device, which comprises at least one LED chip, by means of at least the following steps: potting the at least one LED chip by means of a potting compound containing scattering volumes, wherein the scattering volumes have a lower density than a matrix material of the potting compound in this state; curing the potting compound so that an inhomogeneous distribution of the scattering volumes is obtained owing to floating of the scattering volumes in the matrix material.

Abstract translation: 照明装置具有至少一个通过灌封化合物封装的LED芯片，该灌封化合物具有透光的，可浇注的和可固化的基质材料，其包含作为填充材料的散射体积，其中散射体积不均匀地分布在厚度 的灌封化合物，并且这些散射体积在其浇注状态下具有比基体材料更低的密度。 一种方法用于通过至少以下步骤来制造包括至少一个LED芯片的照明装置：通过包含散射体积的灌封化合物灌封至少一个LED芯片，其中散射体积具有 在这种状态下比灌封化合物的基质材料更低的密度; 固化灌封化合物，使得由于基体材料中的散射体积的浮动，可以获得散射体积的不均匀分布。

公开(公告)号：US20140191255A1

公开(公告)日：2014-07-10

申请号：US14133747

申请日：2013-12-19

Applicant: OSRAM GmbH

Inventor： Farhang Ghasemi Afshar ,  Krister Bergenek ,  Andreas Dobner ,  Holger Huebner ,  Meik Weckbecker ,  Ralph Wirth

IPC: H01L31/12

CPC classification number: H05B33/0803

Abstract: In various embodiments, a light emitting diode module may include a carrier plate, at least one light emitting diode, and at least one sensor configured to register light emitted by the light emitting diode. The light emitting diode is attached to a light emitting diode installation side of the carrier plate. The sensor is installed countersunk through a hole of the carrier plate in relation to the light emitting diode installation side thereof.

Abstract translation: 在各种实施例中，发光二极管模块可以包括载体板，至少一个发光二极管，以及配置成对发光二极管发射的光进行配准的至少一个传感器。 发光二极管连接到载板的发光二极管安装侧。 传感器相对于其发光二极管安装侧通过承载板的孔安装埋头。

公开(公告)号：US10396251B2

公开(公告)日：2019-08-27

申请号：US15641250

申请日：2017-07-04

Applicant: OSRAM GmbH

Inventor： Andreas Biebersdorf ,  Florian Boesl ,  Krister Bergenek ,  Ralph Wirth

IPC: H01L33/50

Abstract: Various embodiments may relate to A light-emitting diode, including an LED chip having at least one emitter surface for emitting primary light, and a plurality of luminescent regions, which are connected optically downstream from the at least one emitter surface. At least one harder one of the luminescent regions is embedded in another, softer one of the luminescent regions.

公开(公告)号：US20180347773A1

公开(公告)日：2018-12-06

申请号：US15779537

申请日：2016-11-03

Applicant: OSRAM GmbH

Inventor： Krister Bergenek ,  Joerg Sorg

IPC: F21S41/141 ,  F21S41/16 ,  F21S41/14 ,  F21S41/675 ,  F21S41/657 ,  H01L33/50

CPC classification number: F21S41/141 ,  F21S41/14 ,  F21S41/16 ,  F21S41/18 ,  F21S41/657 ,  F21S41/675 ,  F21S45/47 ,  H01L33/504

Abstract: A light generating device, comprising: at least one light emitting diode having a semiconductor layer that emits a first primary light, and having a phosphor layer arranged on the semiconductor layer, and at least one laser for generating at least one laser beam composed of a second primary light, by means of which the phosphor layer is irradiatable, wherein the phosphor layer is configured for at least partly converting the first primary light into at least one first secondary light and for at least partly converting the second primary light into at least one second secondary light. The light generating device is configured to dynamically illuminate the phosphor layer by means of the second primary light.

公开(公告)号：US20170301830A1

公开(公告)日：2017-10-19

申请号：US15641250

申请日：2017-07-04

Applicant: OSRAM GmbH

Inventor： Andreas Biebersdorf ,  Florian Boesl ,  Krister Bergenek ,  Ralph Wirth

IPC: H01L33/50

CPC classification number: H01L33/502 ,  H01L33/504 ,  H01L33/505 ,  H01L33/508

Abstract: Various embodiments may relate to A light-emitting diode, including an LED chip having at least one emitter surface for emitting primary light, and a plurality of luminescent regions, which are connected optically downstream from the at least one emitter surface. At least one harder one of the luminescent regions is embedded in another, softer one of the luminescent regions.

公开(公告)号：US09414447B2

公开(公告)日：2016-08-09

申请号：US14133747

申请日：2013-12-19

Applicant: OSRAM GmbH

Inventor： Farhang Ghasemi Afshar ,  Krister Bergenek ,  Andreas Dobner ,  Holger Huebner ,  Meik Weckbecker ,  Ralph Wirth

IPC: H01L33/52 ,  H01L33/44 ,  H01L23/522 ,  F21V33/00 ,  H05B33/08

CPC classification number: H05B33/0803

Abstract: In various embodiments, a light emitting diode module may include a carrier plate, at least one light emitting diode, and at least one sensor configured to register light emitted by the light emitting diode. The light emitting diode is attached to a light emitting diode installation side of the carrier plate. The sensor is installed countersunk through a hole of the carrier plate in relation to the light emitting diode installation side thereof.

Abstract translation: 在各种实施例中，发光二极管模块可以包括载体板，至少一个发光二极管，以及配置成对发光二极管发射的光进行配准的至少一个传感器。 发光二极管连接到载板的发光二极管安装侧。 传感器相对于其发光二极管安装侧通过承载板的孔安装埋头。

公开(公告)号：US10533729B2

公开(公告)日：2020-01-14

申请号：US14377508

申请日：2013-02-18

Applicant: OSRAM GmbH

Inventor： Krister Bergenek

IPC: F21V13/02 ,  F21V9/32 ,  F21K9/64

Abstract: A light source may include an LED chip having a light-emitting surface, on which a luminophore layer is arranged. The luminophore layer may include adjacently arranged regions having different luminophores. A lighting device may include at least one light source.

公开(公告)号：US10386056B2

公开(公告)日：2019-08-20

申请号：US15251041

申请日：2016-08-30

Applicant: OSRAM GmbH

Inventor： Tobias Schmidt ,  Krister Bergenek ,  Frank Vollkommer ,  Philipp Erhard ,  Andreas Kloss

IPC: F21V29/85 ,  F21V29/70 ,  F21V3/02 ,  F21V7/04 ,  F21V17/16 ,  F21V23/00 ,  F21V7/22 ,  F21K9/233 ,  F21K9/68 ,  F21V29/89 ,  F21Y115/10 ,  F21V5/00 ,  F21K9/238 ,  F21K9/69 ,  F21Y107/90

Abstract: An illuminant with at least two LEDs mounted on mutually opposite sides of a support plate and a reflection surface formed as a concave mirror, in which concave mirror the LEDs are arranged, wherein a housing part of the illuminant made of a transparent housing material is provided, which housing part at the same time forms an in relation to the main propagation direction lateral external surface of the illuminant and supports a reflecting layer forming the reflection surface at an internal surface opposite to the external surface.