Abstract:
Various embodiments may relate to A light-emitting diode, including an LED chip having at least one emitter surface for emitting primary light, and a plurality of luminescent regions, which are connected optically downstream from the at least one emitter surface. At least one harder one of the luminescent regions is embedded in another, softer one of the luminescent regions.
Abstract:
Various embodiments may relate to an LED module, including a number of first inherently unpackaged LED chips, which are in each case designed to emit light of a first color at a respective light emission area, and a number of second inherently unpackaged LED chips, which are in each case designed to emit light of a second color, different than the first color, at a respective light emission area. The LED chips are provided jointly in a housing, and the respective light emission area of a second LED chip is at least 25% smaller than the respective light emission area of a first LED chip. The sum of the light emission areas of the first LED chips is at least 50% greater than the sum of the light emission areas of the second LED chips.
Abstract:
The invention relates to an illumination device (1) specifically a packaged LED (2), which is embedded in a casing body leaving the bottom side of the LED (2) exposed; on the bottom side, a contacting element (7) is vacuum deposited onto the LED (2), which contacting element protrudes laterally above the LED (2) and allows on a macroscopic level for an electric contacting of the LED (2), namely by connection of flat surfaces, such as welding.
Abstract:
Various embodiments relate to an optoelectronic component, including a carrier element, on which at least one optoelectronic semiconductor chip is arranged, and a cover, which is mounted on the carrier element in a region extending circumferentially around the semiconductor chip and together with the carrier element forms a sealed cavity in which the at least one optoelectronic semiconductor chip is arranged in an inert gas.
Abstract:
Various embodiments relate to an optoelectronic component, including a carrier element, on which at least one optoelectronic semiconductor chip is arranged, and a cover, which is mounted on the carrier element in a region extending circumferentially around the semiconductor chip and together with the carrier element forms a sealed cavity in which the at least one optoelectronic semiconductor chip is arranged in an inert gas.
Abstract:
A TOF camera for determining a distance to an object comprising: a radiation source configured to emit electromagnetic radiation toward the object, radiation-sensitive sensor elements configured and arranged to detect the electromagnetic radiation reflected/scattered by the object, an optical element arranged to influence the emitted electromagnetic radiation in the radiation path of the reflected/scattered electromagnetic radiation between the object and the sensor elements, a computing unit electrically connected to the radiation source and sensor elements configured to determine a time duration required by the electromagnetic radiation from the radiation source to the object; from the object to the sensor elements; and to determine the distance between the TOF camera and the object depending on the time duration determined. The sensor elements and/or the optical element are configured such that different sensor elements detect the reflected/scattered electromagnetic radiation from different solid angles on the far side of the optical element.
Abstract:
Various embodiments may relate to A light-emitting diode, including an LED chip having at least one emitter surface for emitting primary light, and a plurality of luminescent regions, which are connected optically downstream from the at least one emitter surface. At least one harder one of the luminescent regions is embedded in another, softer one of the luminescent regions.
Abstract:
A TOF camera for determining a distance to an object comprising: a radiation source configured to emit electromagnetic radiation toward the object, radiation-sensitive sensor elements configured and arranged to detect the electromagnetic radiation reflected/scattered by the object, an optical element arranged to influence the emitted electromagnetic radiation in the radiation path of the reflected/scattered electromagnetic radiation between the object and the sensor elements, a computing unit electrically connected to the radiation source and sensor elements configured to determine a time duration required by the electromagnetic radiation from the radiation source to the object; from the object to the sensor elements; and to determine the distance between the TOF camera and the object depending on the time duration determined. The sensor elements and/or the optical element are configured such that different sensor elements detect the reflected/scattered electromagnetic radiation from different solid angles on the far side of the optical element.
Abstract:
Various embodiments may relate to A light-emitting diode, including an LED chip having at least one emitter surface for emitting primary light, and a plurality of luminescent regions, which are connected optically downstream from the at least one emitter surface. At least one harder one of the luminescent regions is embedded in another, softer one of the luminescent regions.
Abstract:
Various embodiments may relate to A light-emitting diode, including an LED chip having at least one emitter surface for emitting primary light, and a plurality of luminescent regions, which are connected optically downstream from the at least one emitter surface. At least one harder one of the luminescent regions is embedded in another, softer one of the luminescent regions.