公开(公告)号：US10749055B2

公开(公告)日：2020-08-18

申请号：US16339582

申请日：2017-10-05

Applicant: OSRAM OLED GmbH

Inventor： Dirk Becker ,  Matthias Sperl

IPC: H01L31/18 ,  H01L25/16 ,  H01L31/0232 ,  H01L31/0203 ,  H01L31/02 ,  H01L31/167 ,  H01L33/62

Abstract: A method of producing sensors includes providing a carrier plate; arranging semiconductor chips on the carrier plate, wherein the semiconductor chips include at least radiation-detecting semiconductor chips; providing radiation-transmissive optical elements on the carrier plate provided with the semiconductor chips, wherein a plurality of radiation-transmissive optical elements are provided jointly on the carrier plate provided with the semiconductor chips; and singulating the carrier plate provided with the semiconductor chips and the radiation-transmissive optical elements, thereby forming separate sensors including a section of the carrier plate, at least one radiation-detecting semiconductor chip and at least one radiation-transmissive optical element.

公开(公告)号：US10809358B2

公开(公告)日：2020-10-20

申请号：US16483037

申请日：2018-01-30

Applicant: OSRAM OLED GmbH

Inventor： Dirk Becker ,  Martin Haushalter ,  Claus Jaeger

IPC: H04B10/00 ,  G01S7/481 ,  G01V8/14

Abstract: A measuring arrangement having an optical transmitter and an optical receiver are disclosed. In an embodiment a measuring arrangement includes an optical transmitter configured to transmit electromagnetic measuring radiation into a transmission space, an optical receiver configured to receive measuring radiation reflected by an object in a reception space and a covering configured to reduce reception of an interference radiation by the receiver, wherein the interference radiation is measuring radiation not reflected by the object.