公开(公告)号：US20200161495A1

公开(公告)日：2020-05-21

申请号：US16631847

申请日：2018-07-11

Applicant: OSRAM OLED GmbH

Inventor： Harald Jaeger ,  Daniel Leisen ,  Jens EBERHARD ,  Ivar Tangring

IPC: H01L33/00 ,  H01L33/48 ,  H01L25/075

Abstract: An optoelectronic component may be produced by providing a temporary carrier, applying a functional film to the temporary carrier, arranging optoelectronic elements within openings of the functional film in such a way that the mounting sides are facing towards the temporary carrier. The optoelectronic elements are thicker than the functional film such that the elements protrude beyond the functional film in a direction away from the temporary carrier. The method may further include applying a potting compound laterally around the elements and covering the function film and curing the potting compound to form a potting. The method may further include cutting between the openings to create individual optoelectronic components.

公开(公告)号：US11139415B2

公开(公告)日：2021-10-05

申请号：US16631847

申请日：2018-07-11

Applicant: OSRAM OLED GmbH

Inventor： Harald Jaeger ,  Daniel Leisen ,  Jens Eberhard ,  Ivar Tangring

IPC: H01L33/00 ,  H01L25/075 ,  H01L33/48

Abstract: An optoelectronic component may be produced by providing a temporary carrier, applying a functional film to the temporary carrier, arranging optoelectronic elements within openings of the functional film in such a way that the mounting sides are facing towards the temporary carrier. The optoelectronic elements are thicker than the functional film such that the elements protrude beyond the functional film in a direction away from the temporary carrier. The method may further include applying a potting compound laterally around the elements and covering the function film and curing the potting compound to form a potting. The method may further include cutting between the openings to create individual optoelectronic components.