公开(公告)号：US10777713B2

公开(公告)日：2020-09-15

申请号：US16315020

申请日：2017-06-30

Applicant: OSRAM OLED GmbH

Inventor： Ivar Tangring

IPC: H01L33/50 ,  H01L33/60

Abstract: A method of producing an optoelectronic lighting device includes forming a volume emitter such that it is at least partly transmissive to generated electromagnetic radiation, forming a concavely formed, optically transparent frame element including a curable, flowable material including phosphor particles at a side region of the volume emitter, wherein forming a conversion layer that converts the electromagnetic radiation into a second wavelength range is carried out by a sedimentation process of phosphor particles, and the conversion layer is formed within an optically transparent frame element in a manner adjoining an optically active region, forming a reflection element on the optically transparent frame element, and forming a conversion element that converts the electromagnetic radiation into a second wavelength range, wherein the conversion element is formed in a manner overlapping at least a second surface of the volume emitter and frame element.

公开(公告)号：US11616175B2

公开(公告)日：2023-03-28

申请号：US16769531

申请日：2018-12-10

Applicant: Osram OLED GmbH

Inventor： Ralph Bertram ,  Ivar Tangring ,  Philipp Pust

IPC: H01L33/56 ,  H01L33/50 ,  C09K11/02

Abstract: The invention relates to a luminophore mixture which comprises at least one quantum dot luminophore and at least one functional material, the functional material is formed such that it scatters electromagnetic radiation and/or has a high density.

公开(公告)号：US20210320232A1

公开(公告)日：2021-10-14

申请号：US17273773

申请日：2019-08-27

Applicant: OSRAM OLED GmbH

Inventor： Ivar Tangring ,  Susanne Brunner

IPC: H01L33/50 ,  H01L33/62 ,  H01L33/60

Abstract: In an embodiment an optoelectronic component includes a radiation-emitting semiconductor chip configured to emit electromagnetic primary radiation from a radiation exit surface, a conversion element configured to convert the primary radiation into electromagnetic secondary radiation, wherein the conversion element has a frame which covers side surfaces of a conversion segment, and wherein the frame is formed reflective, and a bonding agent fixing the conversion element on the radiation exit surface of the semiconductor chip, wherein a contact point of the semiconductor chip projects beyond the conversion element in an edge region of the semiconductor chip in lateral directions, and wherein the bonding agent covers an outer surface of the frame and the contact point of the semiconductor chip in places.

公开(公告)号：US11094689B2

公开(公告)日：2021-08-17

申请号：US16649826

申请日：2018-09-20

Applicant: OSRAM OLED GmbH

Inventor： Ivar Tangring ,  Thomas Schlereth

IPC: H01L27/02 ,  H01L29/86 ,  H01L25/16 ,  H01L29/861

Abstract: An electronic component includes a first contact point for n-side contacting, a second contact point for p-side contacting, and a protective diode, which is connected antiparallel to the first contact point and to the second contact point. The protective diode includes a first diode structure which is p-conductive and a second diode structure which is n-conductive. The first diode structure is formed as a layer which overlaps in places with the first contact point in a first overlap region. The second diode structure is formed as a layer which overlaps in places with the second contact point in a second overlap region. The first diode structure and the second diode structure overlap each other in a third overlap region.

公开(公告)号：US11139415B2

公开(公告)日：2021-10-05

申请号：US16631847

申请日：2018-07-11

Applicant: OSRAM OLED GmbH

Inventor： Harald Jaeger ,  Daniel Leisen ,  Jens Eberhard ,  Ivar Tangring

IPC: H01L33/00 ,  H01L25/075 ,  H01L33/48

Abstract: An optoelectronic component may be produced by providing a temporary carrier, applying a functional film to the temporary carrier, arranging optoelectronic elements within openings of the functional film in such a way that the mounting sides are facing towards the temporary carrier. The optoelectronic elements are thicker than the functional film such that the elements protrude beyond the functional film in a direction away from the temporary carrier. The method may further include applying a potting compound laterally around the elements and covering the function film and curing the potting compound to form a potting. The method may further include cutting between the openings to create individual optoelectronic components.

公开(公告)号：US11121287B2

公开(公告)日：2021-09-14

申请号：US16627616

申请日：2018-07-09

Applicant: OSRAM OLED GmbH

Inventor： Ivar Tangring

IPC: H01L33/48 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L23/00

Abstract: A method for producing an optoelectronic component and an optoelectronic component are disclosed. In an embodiment a method includes providing a carrier having a pedestal with a support surface, applying a liquid joining material with filler particles to the support surface of the pedestal and applying a radiation emitting semiconductor chip with a mounting surface, which is larger than the support surface of the pedestal to the liquid joining material such that the joining material forms a joining layer between the support surface of the pedestal and the mounting surface of the semiconductor chip and the joining material at least partially fills only a recess, which is limited by a part of the mounting surface projecting beyond the support surface.

公开(公告)号：US10731797B2

公开(公告)日：2020-08-04

申请号：US16087949

申请日：2017-03-23

Applicant: OSRAM OLED GmbH

Inventor： Thomas Schlereth ,  Elena Rachkova ,  Michael Bestele ,  Ivar Tangring

IPC: F21K9/232 ,  H01L25/075 ,  F21K9/275 ,  H01L33/54 ,  H01L33/50 ,  H01L33/62 ,  F21Y115/10 ,  F21Y103/10

Abstract: A filament includes a multiplicity of light-emitting semiconductor chips, wherein the semiconductor chips are arranged on a carrier, the semiconductor chips being electrically contacted, a scattering structure is configured to scatter light of the light-emitting semiconductor chips, the scattering structure is formed by structuring a surface, a converter covers the light-emitting semiconductor chips, and the structuring of the surface is formed on a surface of the converter.

公开(公告)号：US20200161495A1

公开(公告)日：2020-05-21

申请号：US16631847

申请日：2018-07-11

Applicant: OSRAM OLED GmbH

Inventor： Harald Jaeger ,  Daniel Leisen ,  Jens EBERHARD ,  Ivar Tangring

IPC: H01L33/00 ,  H01L33/48 ,  H01L25/075

Abstract: An optoelectronic component may be produced by providing a temporary carrier, applying a functional film to the temporary carrier, arranging optoelectronic elements within openings of the functional film in such a way that the mounting sides are facing towards the temporary carrier. The optoelectronic elements are thicker than the functional film such that the elements protrude beyond the functional film in a direction away from the temporary carrier. The method may further include applying a potting compound laterally around the elements and covering the function film and curing the potting compound to form a potting. The method may further include cutting between the openings to create individual optoelectronic components.