公开(公告)号：US20200211997A1

公开(公告)日：2020-07-02

申请号：US16622161

申请日：2018-06-06

Applicant: OSRAM OLED GmbH

Inventor： Klaus Mueller ,  Andreas Ploessl ,  Mathias Wendt

IPC: H01L23/00

Abstract: A method for fastening a semiconductor chip on a substrate and an electronic component are disclosed. In an embodiment a method includes providing a semiconductor chip, applying a solder metal layer sequence on the semiconductor chip, providing a substrate, applying a metallization layer sequence on the substrate, applying the semiconductor chip on the substrate via the solder metal layer sequence and the metallization layer sequence and heating the applied semiconductor chip on the substrate for fastening the semiconductor chip on the substrate. The solder metal layer may include a first metallic layer comprising an indium-tin alloy, a barrier layer arranged above the first metallic layer and a second metallic layer comprising gold arranged between the barrier layer and the semiconductor chip, wherein an amount of substance of the gold in the second metallic layer is greater than an amount of substance of tin in the first metallic layer.

公开(公告)号：US20220208715A1

公开(公告)日：2022-06-30

申请号：US17699719

申请日：2022-03-21

Applicant: OSRAM OLED GmbH

Inventor： Klaus Mueller ,  Andreas Ploessl ,  Mathias Wendt

IPC: H01L23/00

Abstract: In an embodiment a method includes providing a semiconductor chip, applying a solder metal layer sequence on the semiconductor chip, providing a substrate, applying a metallization layer sequence on the substrate, applying the semiconductor chip on the substrate via the solder metal layer sequence and the metallization layer sequence and heating the applied semiconductor chip on the substrate for fastening the semiconductor chip on the substrate, wherein the solder metal layer sequence includes a first metallic layer including an indium-tin alloy, a barrier layer arranged above the first metallic layer, and a second metallic layer having gold arranged between the barrier layer and the semiconductor chip, and wherein the indium-tin alloy has the following formula: InxSn1-x with 0.04≤x≤0.2.

公开(公告)号：US11315898B2

公开(公告)日：2022-04-26

申请号：US16622161

申请日：2018-06-06

Applicant: OSRAM OLED GmbH

Inventor： Klaus Mueller ,  Andreas Ploessl ,  Mathias Wendt

IPC: H01L23/00

Abstract: A method for fastening a semiconductor chip on a substrate and an electronic component are disclosed. In an embodiment a method includes providing a semiconductor chip, applying a solder metal layer sequence on the semiconductor chip, providing a substrate, applying a metallization layer sequence on the substrate, applying the semiconductor chip on the substrate via the solder metal layer sequence and the metallization layer sequence and heating the applied semiconductor chip on the substrate for fastening the semiconductor chip on the substrate. The solder metal layer may include a first metallic layer comprising an indium-tin alloy, a barrier layer arranged above the first metallic layer and a second metallic layer comprising gold arranged between the barrier layer and the semiconductor chip, wherein an amount of substance of the gold in the second metallic layer is greater than an amount of substance of tin in the first metallic layer.