公开(公告)号：US20210273144A1

公开(公告)日：2021-09-02

申请号：US17253566

申请日：2019-07-01

Applicant: OSRAM OLED GmbH

Inventor： Konrad WAGNER ,  Daniel RICHTER ,  Gunnar PETERSEN ,  Nicole BERNER ,  Michael FÖRSTER

IPC: H01L33/54 ,  H01L25/075 ,  H01L33/56

Abstract: An optoelectronic component (1) is specified, with at least one radiation-emitting semiconductor chip generating electromagnetic radiation during operation, a coating surrounding the at least one semiconductor chip in lateral directions, a magnetic structure covered by the coating, wherein the magnetic structure enables the component to be identified. Furthermore, a process for the manufacture of such an optoelectronic component is given.

公开(公告)号：US20200266139A1

公开(公告)日：2020-08-20

申请号：US16758371

申请日：2018-10-30

Applicant: OSRAM OLED GmbH

Inventor： Jörg Erich SORG ,  Konrad WAGNER ,  Michael FÖRSTER ,  Josef HIRN

IPC: H01L23/498 ,  H01L25/16 ,  H01L25/075 ,  H01L33/64 ,  H01L33/62 ,  H01L21/48

Abstract: Carrier with an electrically insulating base material, electrically conductive through-connections and a thermal connection element. The through-connections and the thermal connection element are each completely surrounded by the base material in the lateral direction, the thermal connection element and the through-connections completely penetrating the base material perpendicularly to the main extension plane of the carrier, and the thermal connection element being formed with a material which has a thermal conductivity of at least 200 W/(m K).

公开(公告)号：US20210098666A1

公开(公告)日：2021-04-01

申请号：US16954472

申请日：2018-12-18

Applicant: OSRAM OLED GmbH

Inventor： Michael FOERSTER ,  Konrad WAGNER ,  Benjamin SCHULZ ,  Stefan MORGOTT ,  l-Hsin LIN-LEFEBVRE

IPC: H01L33/60 ,  H01L25/075 ,  H01L33/54 ,  H01L33/50

Abstract: In one embodiment, the optoelectronic semiconductor component comprises at least one semiconductor chip for generating a primary radiation, and also an optical body disposed optically downstream of the semiconductor chip. A reflector surrounds the optical body laterally all around in a positively locking manner and is configured for reflecting the primary radiation and visible light. The optical body has a base surface facing the semiconductor chip and an exit surface facing away from the semiconductor chip. The optical body tapers in a direction away from the semiconductor chip. A quotient of the base surface and a height of the optical body is between 1 mm and 30 mm inclusive.