公开(公告)号：US20210318501A1

公开(公告)日：2021-10-14

申请号：US17252908

申请日：2019-07-16

Applicant: OSRAM OLED GmbH

Inventor： Luca HAIBERGER ,  Daniel RICHTER

IPC: G02B6/42 ,  H01L25/075

Abstract: In one embodiment, the optoelectronic component comprises a first emission zone, which emits electromagnetic radiation during operation. Furthermore, the component comprises an optical waveguide with an entrance side facing the first emission zone, a distribution element and with output coupling structures on a side of the distribution element facing away from the first emission zone. The optical waveguide is a simply connected solid body. In a top view of the side of the optical waveguide facing away from the first emission zone, the distribution element completely covers the first emission zone. The output coupling structures are individual, spaced-apart elevations, each of which extends away from the distribution element and comprises an output coupling surface at an end facing away from the distribution element. A structure that is nontransmissive to the radiation of the first emission zone is arranged on the optical waveguide in the region between the output coupling structures.

公开(公告)号：US20210273144A1

公开(公告)日：2021-09-02

申请号：US17253566

申请日：2019-07-01

Applicant: OSRAM OLED GmbH

Inventor： Konrad WAGNER ,  Daniel RICHTER ,  Gunnar PETERSEN ,  Nicole BERNER ,  Michael FÖRSTER

IPC: H01L33/54 ,  H01L25/075 ,  H01L33/56

Abstract: An optoelectronic component (1) is specified, with at least one radiation-emitting semiconductor chip generating electromagnetic radiation during operation, a coating surrounding the at least one semiconductor chip in lateral directions, a magnetic structure covered by the coating, wherein the magnetic structure enables the component to be identified. Furthermore, a process for the manufacture of such an optoelectronic component is given.

公开(公告)号：US20200176653A1

公开(公告)日：2020-06-04

申请号：US16626899

申请日：2018-06-21

Applicant: OSRAM OLED GmbH

Inventor： Daniel RICHTER ,  Sven WEBER-RABSILBER

IPC: H01L33/62 ,  H01L33/48

Abstract: An optoelectronic semiconductor component may include a housing having a recess, and a chip carrier which is a part of the housing. The chip carrier may have a first fastening side and an upper side. The optoelectronic semiconductor chip may be mounted on the upper side in the recess. First electrical contact pads for external electrical contacting may be located on the first fastening side. Furthermore, second electrical contact pads for external electrical contacting may be located on a second fastening side, opposite to the first fastening side, of the housing. First and second electrical contact pads electrically assigned to one another may be electrically short-circuited so that the semiconductor component can be electrically contacted by the first or by the second fastening side.

公开(公告)号：US20210311299A1

公开(公告)日：2021-10-07

申请号：US17263026

申请日：2019-07-18

Applicant: OSRAM OLED GMBH

Inventor： Daniel RICHTER ,  Luca HAIBERGER

IPC: G02B26/08 ,  G02B26/00 ,  G02B30/30 ,  G02B27/28 ,  G02B30/25

Abstract: In an embodiment, the display device comprises a light emitting semiconductor chip having a light exit side and a mask layer disposed downstream of the semiconductor chip and comprising a plurality of openings. In the openings, the semiconductor chip is free from the mask layer. A movable cover is made of an opaque material and is configured with a plurality of penetrations for adjusting a radiation characteristic of the semiconductor chip. The penetrations are at least temporarily associated with the openings. A drive unit is provided for moving the cover in the direction parallel to the light exit side.