公开(公告)号：US20210175397A1

公开(公告)日：2021-06-10

申请号：US17181458

申请日：2021-02-22

Applicant: OSRAM OLED GmbH

Inventor： Markus PINDL ,  Thomas SCHWARZ ,  Frank SINGER ,  Sandra SOBCZYK

IPC: H01L33/54 ,  H01L33/50 ,  H01L33/00 ,  H01L31/18 ,  H01L31/0232 ,  H01L31/0203 ,  H01L33/48 ,  H01L21/56 ,  H01L33/56

Abstract: The invention relates to a method for producing a plurality of optoelectronic semiconductor components, including the following steps: preparing a plurality of semiconductor chips spaced in a lateral direction to one another; forming a housing body assembly, at least one region of which is arranged between the semiconductor chips; forming a plurality of fillets, each adjoining a semiconductor chip and being bordered in a lateral direction by a side surface of each semiconductor chip and the housing body assembly; and separating the housing body assembly into a plurality of optoelectronic components, each component having at least one semiconductor chip and a portion of the housing body assembly as a housing body, and each semiconductor chip not being covered by material of the housing body on a radiation emission surface of the semiconductor component, which surface is located opposite a mounting surface. The invention also relates to a semiconductor component.

公开(公告)号：US20230031493A1

公开(公告)日：2023-02-02

申请号：US17960794

申请日：2022-10-05

Applicant: OSRAM OLED GmbH

Inventor： Markus PINDL ,  Thomas SCHWARZ ,  Frank SINGER ,  Sandra SOBCZYK

IPC: H01L33/54 ,  H01L33/00 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/50

Abstract: The invention relates to a method for producing a plurality of optoelectronic semiconductor components, including the following steps: preparing a plurality of semiconductor chips spaced in a lateral direction to one another; forming a housing body assembly, at least one region of which is arranged between the semiconductor chips; forming a plurality of fillets, each adjoining a semiconductor chip and being bordered in a lateral direction by a side surface of each semiconductor chip and the housing body assembly; and separating the housing body assembly into a plurality of optoelectronic components, each component having at least one semiconductor chip and a portion of the housing body assembly as a housing body, and each semiconductor chip not being covered by material of the housing body on a radiation emission surface of the semiconductor component, which surface is located opposite a mounting surface. The invention also relates to a semiconductor component.

公开(公告)号：US20200266321A1

公开(公告)日：2020-08-20

申请号：US16866890

申请日：2020-05-05

Applicant: OSRAM OLED GmbH

Inventor： Markus PINDL ,  Thomas SCHWARZ ,  Frank SINGER ,  Sandra SOBCZYK

IPC: H01L33/54 ,  H01L33/50 ,  H01L31/18 ,  H01L31/0232 ,  H01L31/0203 ,  H01L33/00

Abstract: The invention relates to a method for producing a plurality of optoelectronic semiconductor components, comprising the following steps: preparing a plurality of semiconductor chips spaced in a lateral direction to one another; forming a housing body assembly, at least one region of which is arranged between the semiconductor chips; forming a plurality of fillets, each adjoining a semiconductor chip and being bordered in a lateral direction by a side surface of each semiconductor chip and the housing body assembly; and separating the housing body assembly into a plurality of optoelectronic components, each component having at least one semiconductor chip and a portion of the housing body assembly as a housing body, and each semiconductor chip not being covered by material of the housing body on a radiation emission surface of the semiconductor component, which surface is located opposite a mounting surface. The invention also relates to a semiconductor component.