公开(公告)号：US20210057391A1

公开(公告)日：2021-02-25

申请号：US16964339

申请日：2019-01-29

Applicant: OSRAM OLED GmbH

Inventor： Martin Behringer

IPC: H01L25/075 ,  G09G3/32 ,  H01L23/538

Abstract: An optoelectronic circuit assembly has a first optoelectronic component and a second optoelectronic component, wherein the optoelectronic components each comprise a housing body with an upper face and a lower face, wherein in the housing body of each optoelectronic component, a first optoelectronic semiconductor chip and a second optoelectronic semiconductor chip are embedded, wherein the optoelectronic components are mounted on a circuit board, wherein the first optoelectronic semiconductor chip of the first optoelectronic component and the first optoelectronic semiconductor chip of the second optoelectronic component are connected to a first conductor track in an electrically conductive manner, wherein the second optoelectronic semiconductor chip of the first optoelectronic component and the second optoelectronic semiconductor chip of the second optoelectronic component are connected to a second conductor track in an electrically conductive manner, wherein the first optoelectronic semiconductor chip or the second optoelectronic semiconductor chip of the first optoelectronic component is defective.

公开(公告)号：US11205643B2

公开(公告)日：2021-12-21

申请号：US16964339

申请日：2019-01-29

Applicant: OSRAM OLED GmbH

Inventor： Martin Behringer

IPC: H01L25/075 ,  G09G3/32 ,  H01L23/538

Abstract: An optoelectronic circuit assembly has a first optoelectronic component and a second optoelectronic component, wherein the optoelectronic components each comprise a housing body with an upper face and a lower face, wherein in the housing body of each optoelectronic component, a first optoelectronic semiconductor chip and a second optoelectronic semiconductor chip are embedded, wherein the optoelectronic components are mounted on a circuit board, wherein the first optoelectronic semiconductor chip of the first optoelectronic component and the first optoelectronic semiconductor chip of the second optoelectronic component are connected to a first conductor track in an electrically conductive manner, wherein the second optoelectronic semiconductor chip of the first optoelectronic component and the second optoelectronic semiconductor chip of the second optoelectronic component are connected to a second conductor track in an electrically conductive manner, wherein the first optoelectronic semiconductor chip or the second optoelectronic semiconductor chip of the first optoelectronic component is defective.

公开(公告)号：US20210320006A1

公开(公告)日：2021-10-14

申请号：US17267307

申请日：2019-08-09

Applicant: OSRAM OLED GmbH

Inventor： Martin Behringer ,  Alexander Behres ,  Asako Hirai

IPC: H01L21/02 ,  H01L21/683 ,  H01L23/00

Abstract: A method for producing a semiconductor component and workpiece are disclosed. In an embodiment a method includes forming a first semiconductor layer over a growth substrate, wherein a material of the first semiconductor layer is Inx1Aly1Ga(1-x1-y1)N, with 0≤xl≤1, 0≤yl≤1, applying a first modification substrate over the first semiconductor layer, wherein a material of the first modification substrate has a thermal expansion coefficient which is different from that of the first semiconductor layer, removing the growth substrate thereby obtaining a first layer stack, heating the first layer stack to a first growth temperature and growing a second semiconductor layer over a growth surface of the first semiconductor layer after heating the first layer stack, wherein due to heating a lattice constant of the first semiconductor layer is adapted to a lattice constant of the second semiconductor layer.