公开(公告)号：US20210320232A1

公开(公告)日：2021-10-14

申请号：US17273773

申请日：2019-08-27

Applicant: OSRAM OLED GmbH

Inventor： Ivar Tangring ,  Susanne Brunner

IPC: H01L33/50 ,  H01L33/62 ,  H01L33/60

Abstract: In an embodiment an optoelectronic component includes a radiation-emitting semiconductor chip configured to emit electromagnetic primary radiation from a radiation exit surface, a conversion element configured to convert the primary radiation into electromagnetic secondary radiation, wherein the conversion element has a frame which covers side surfaces of a conversion segment, and wherein the frame is formed reflective, and a bonding agent fixing the conversion element on the radiation exit surface of the semiconductor chip, wherein a contact point of the semiconductor chip projects beyond the conversion element in an edge region of the semiconductor chip in lateral directions, and wherein the bonding agent covers an outer surface of the frame and the contact point of the semiconductor chip in places.