公开(公告)号：US20200176653A1

公开(公告)日：2020-06-04

申请号：US16626899

申请日：2018-06-21

Applicant: OSRAM OLED GmbH

Inventor： Daniel RICHTER ,  Sven WEBER-RABSILBER

IPC: H01L33/62 ,  H01L33/48

Abstract: An optoelectronic semiconductor component may include a housing having a recess, and a chip carrier which is a part of the housing. The chip carrier may have a first fastening side and an upper side. The optoelectronic semiconductor chip may be mounted on the upper side in the recess. First electrical contact pads for external electrical contacting may be located on the first fastening side. Furthermore, second electrical contact pads for external electrical contacting may be located on a second fastening side, opposite to the first fastening side, of the housing. First and second electrical contact pads electrically assigned to one another may be electrically short-circuited so that the semiconductor component can be electrically contacted by the first or by the second fastening side.