公开(公告)号：US20130329103A1

公开(公告)日：2013-12-12

申请号：US13966672

申请日：2013-08-14

Applicant: Orbotech Ltd.

Inventor： Yigal KATZIR ,  Itay GUR-ARIE ,  Yacov MALINOVICH

IPC: H04N3/14

CPC classification number: H04N3/155 ,  G01N21/8851 ,  G01N21/8901 ,  G01N21/956 ,  H01L27/14645 ,  H04N5/3743 ,  H04N5/37455

Abstract: An inspection system includes a CMOS integrated circuit having integrally formed thereon an at least two dimensional array of photosensors and providing an inspection output representing an object to be inspected. A defect analyzer is operative to receive the inspection output and to provide a defect report.

Abstract translation: 检查系统包括CMOS集成电路，其上整体地形成有至少二维光电传感器阵列，并提供表示待检查对象的检查输出。 缺陷分析仪用于接收检查输出并提供缺陷报告。

公开(公告)号：US20230259070A1

公开(公告)日：2023-08-17

申请号：US18013112

申请日：2021-06-17

Applicant: Orbotech Ltd.

Inventor： Yigal KATZIR ,  Boaz ROSENBERG ,  Nir TURKO

IPC: G03H1/04 ,  G01B9/02 ,  G01B9/02055

CPC classification number: G03H1/0443 ,  G01B9/02047 ,  G01B9/02078

Abstract: A method for reconstructing a digital hologram of a surface having at least one three- dimensional feature thereon, including acquiring a digital hologram of the surface, reconstructing a wavefront based on the digital hologram, generating a phase map of at least a portion of the surface based on the wavefront, the phase map including phase ambiguities, obtaining at least one additional image of the surface, obtaining height data relating to the three-dimensional feature from the at least one additional image of the surface, the height data being obtained with a first precision, resolving the phase ambiguities based on the height data and deriving a height of the at least one three- dimensional feature based on the phase map following the resolving of the phase ambiguities therein, the height being derived with a second precision more precise than the first precision.

公开(公告)号：US20160094760A1

公开(公告)日：2016-03-31

申请号：US14964781

申请日：2015-12-10

Applicant: Orbotech Ltd.

Inventor： Yigal KATZIR ,  Itay GUR-ARIE ,  Yacov MALINOVICH

IPC: H04N3/14 ,  H04N5/3745 ,  H04N5/374

CPC classification number: H04N3/155 ,  G01N21/8851 ,  G01N21/8901 ,  G01N21/956 ,  H01L27/14645 ,  H04N5/3743 ,  H04N5/37455

Abstract: An inspection system includes a CMOS integrated circuit having integrally formed thereon an at least two dimensional array of photosensors and providing an inspection output representing an object to be inspected. A defect analyzer is operative to receive the inspection output and to provide a defect report.

公开(公告)号：US20210360140A1

公开(公告)日：2021-11-18

申请号：US17274046

申请日：2019-08-27

Applicant: ORBOTECH LTD.

Inventor： Yigal KATZIR ,  Ilia LUTSKER ,  Elie MEIMOUN

IPC: H04N5/235 ,  H04N5/265 ,  G01N21/956

Abstract: An inspection system including an illumination subsystem and an image sensing subsystem, the illumination subsystem providing a plurality of illumination modalities, the system simultaneously illuminating at least two areas of an object with different ones of the plurality of illumination modalities, images of which are acquired by a single sensor forming part of the image sensing subsystem.