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公开(公告)号:US20170094422A1
公开(公告)日:2017-03-30
申请号:US15263801
申请日:2016-09-13
Applicant: OTICON A/S , BERNAFON AG
Inventor: Roland MARGOT , Ben CROOK , Lars PERSSON , Henning BJERREGAARD , Sune HEIBING , Niels Erik Holm CHRISTENSEN , Mikael ANDERSEN , Claus TIPSMARK , Martin LARSEN , Peter SPRAGGE , Lars MONROY , Poul Hilding ANDERSSON
CPC classification number: H04R25/456 , H04R1/2876 , H04R25/604 , H04R2460/17
Abstract: A hearing aid comprising a receiver assembly is disclosed. The receiver assembly includes a receiver and suspension member arranged in a housing. The suspension member comprises vibration dampers protruding from an outer periphery of the suspension member, and one or more cushions or one or more enclosed structures containing a material are provided between the receiver and the suspension member.
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公开(公告)号:US20250113150A1
公开(公告)日:2025-04-03
申请号:US18888220
申请日:2024-09-18
Applicant: Oticon A/S
Inventor: Saeed Doagou RAD , Peter SPRAGGE
IPC: H04R25/00
Abstract: Disclosed herein are embodiments of a hearing aid. The hearing aid can include a number of electric charge contact, wherein the electric charge contact is a metallic component configured to provide electrical conduction. A coating at least partially covers the metallic component, the coating including a first layer at least partially located on the metallic component, wherein the first layer is gold, and a second layer at least partially located on the first layer, wherein the second layer is palladium.
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公开(公告)号:US20200077211A1
公开(公告)日:2020-03-05
申请号:US16677421
申请日:2019-11-07
Applicant: Oticon A/S
Inventor: Søren WICHMANN , Oliver SUNDBERG , Rasmus ANDERSSON , Peter SPRAGGE , Martin LARSEN , Peter H. WEIS , Anders Hedelund NIELSEN
Abstract: A hearing aid device comprising a microphone, a processing unit and a receiver for compensating for a hearing loss in the auditory system of a human is disclosed. The hearing aid device is configured with a microphone inlet assembly which is optimized with regards to maintenance of the hearing aid and improved sound performance. That is, the microphone inlet assembly comprises an inlet element attached to a PCB and further configured to connect with a sound inlet structure.
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公开(公告)号:US20180324531A1
公开(公告)日:2018-11-08
申请号:US16033801
申请日:2018-07-12
Applicant: OTICON A/S , BERNAFON AG
Inventor: Roland MARGOT , Ben CROOK , Lars PERSSON , Henning BJERREGAARD , Sune HEIBING , Niels Erik Holm CHRISTENSEN , Mikael ANDERSEN , Claus TIPSMARK , Martin LARSEN , Peter SPRAGGE , Lars MONROY , Poul Hilding ANDERSSON
CPC classification number: H04R25/456 , H04R1/2876 , H04R25/604 , H04R2460/17
Abstract: A hearing aid comprising a receiver assembly is disclosed. The receiver assembly includes a housing adapted to accommodate receivers of different geometry and/or size and/or mechanical dimensions and suspension member arranged in the housing. The suspension member comprises vibration dampers protruding from an outer periphery of the suspension member and a plurality of spacers provided at an inner periphery of the suspension member. The plurality of spacers is positioned to arrange and fix one or more cushions or enclosed structures in predefined grooves formed by adjacent spacers in the space between the receiver and the suspension member.
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公开(公告)号:US20180249261A1
公开(公告)日:2018-08-30
申请号:US15904615
申请日:2018-02-26
Applicant: Oticon A/S
Inventor: Søren WICHMANN , Oliver SUNDBERG , Rasmus ANDERSSON , Peter SPRAGGE , Martin LARSEN , Peter H. WEIS , Anders Hedelund NIELSEN
CPC classification number: H04R25/604 , H04R1/342 , H04R25/402 , H04R25/654 , H04R31/006 , H04R2201/003 , H05K1/181 , H05K2201/09063 , H05K2201/10083 , Y02P70/611
Abstract: A hearing aid device comprising a microphone, a processing unit and a receiver for compensating for a hearing loss in the auditory system of a human is disclosed. The hearing aid device is configured with a microphone inlet assembly which is optimized with regards to maintenance of the hearing aid and improved sound performance. That is, the microphone inlet assembly comprises an inlet element attached to a PCB and further configured to connect with a sound inlet structure.
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