Abstract:
Various gel electrophoretic assemblies and techniques are disclosed for providing unique isoelectric focusing (IEF) strategies. Several particular systems, assemblies and methods are provided that significantly reduce processing time, enable the use of reduced operating voltages, and produce analytical results with improved resolution.
Abstract:
Various traveling wave grids and electrophoretic systems, and electrode assemblies using such grids, are disclosed. A configuration in which a voltage potential is used to load a biomolecule sample against a grid is disclosed. A unique strategy of using multiple, reconfigurable grids in such systems is also described. The strategy involves initially conducting a broad protein separation and then selectively tailoring one or more grids, and conducting one or more secondary processing operations. Related strategies and specific methods are additionally disclosed for separating samples of biomolecules and components thereof using the noted systems, assemblies, and grids.
Abstract:
A system and method of operation is described which utilizes an array of piezoelectric actuators distributed over the surface of a diaphragm. In one embodiment, the piezoelectric actuator array is used to cause a net motion of the diaphragm equal to the sum of the motions of each individual sub-chamber diaphragm. The system can be used as a sensor where a common motion applied to the sub-chamber diaphragm causes a net charge equal to the sum of the charges on each piezoelectric diaphragm.
Abstract:
An electrophoretic cell configuration and related method are disclosed that employ oppositely directed traveling electrical waves. The waves travel across the cell and samples undergoing separation. Various strategies are used to selectively direct the movement and arrangement of the samples and resulting sample patterns.
Abstract:
A method of producing at least one piezoelectric element includes depositing a piezoelectric ceramic material onto a surface of a first substrate to form at least one piezoelectric element structure. Then an electrode is deposited on a surface of the at least one piezoelectric element structure. Next, the at least one piezoelectric element structure is bonded to a second substrate, the second substrate being conductive or having a conductive layer. The first substrate is then removed from the at least one piezoelectric element structure and a second side electrode is deposited on a second surface of the at least one piezoelectric element structure. A poling operation is performed to provide the at least one piezoelectric element structure with piezoelectric characteristics. In another embodiment, a material for a thick film element is deposited onto a surface of a first substrate to form a thick film element structure having a thickness of between greater than 10 nullm to 100 nullm. The at least one thick film element structure is bonded to a second substrate. Thereafter, the first substrate is removed from the at least one thick film element structure using a liftoff process which includes emitting, from a radiation source (such as a laser or other appropriate device), a beam through the first substrate to an attachment interface formed between the first substrate and the at least one thick film element structure at the surface of the first substrate. The first substrate is substantially transparent at the wavelength of the beam, and the beam generates sufficient energy at the interface to break the attachment.