公开(公告)号：US20040164650A1

公开(公告)日：2004-08-26

申请号：US10376544

申请日：2003-02-25

Applicant: PALO ALTO RESEARCH CENTER INCORPORATED

Inventor： Baomin Xu ,  Steven A. Buhler ,  Michael C. Weisberg ,  William S. Wong ,  Scott E. Solberg ,  Karl A. Littau ,  John S. Fitch ,  Scott A. Elrod

IPC: H01L041/08

CPC classification number: B41J2/161 ,  B41J2/1623 ,  B41J2/1632 ,  B41J2/1634 ,  B41J2/1637 ,  B41J2/1646 ,  H01L41/313 ,  H01L41/314 ,  H01L41/331 ,  H01L2221/68368 ,  Y10T29/42 ,  Y10T29/435 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49155 ,  Y10T29/4981

Abstract: A method of producing at least one piezoelectric element includes depositing a piezoelectric ceramic material onto a surface of a first substrate to form at least one piezoelectric element structure. Then an electrode is deposited on a surface of the at least one piezoelectric element structure. Next, the at least one piezoelectric element structure is bonded to a second substrate, the second substrate being conductive or having a conductive layer. The first substrate is then removed from the at least one piezoelectric element structure and a second side electrode is deposited on a second surface of the at least one piezoelectric element structure. A poling operation is performed to provide the at least one piezoelectric element structure with piezoelectric characteristics. In another embodiment, a material for a thick film element is deposited onto a surface of a first substrate to form a thick film element structure having a thickness of between greater than 10 nullm to 100 nullm. The at least one thick film element structure is bonded to a second substrate. Thereafter, the first substrate is removed from the at least one thick film element structure using a liftoff process which includes emitting, from a radiation source (such as a laser or other appropriate device), a beam through the first substrate to an attachment interface formed between the first substrate and the at least one thick film element structure at the surface of the first substrate. The first substrate is substantially transparent at the wavelength of the beam, and the beam generates sufficient energy at the interface to break the attachment.

Abstract translation: 制造至少一个压电元件的方法包括将压电陶瓷材料沉积到第一基板的表面上以形成至少一个压电元件结构。 然后在至少一个压电元件结构的表面上沉积电极。 接下来，将至少一个压电元件结构接合到第二基板，第二基板是导电的或具有导电层。 然后从至少一个压电元件结构去除第一衬底，并且第二侧电极沉积在至少一个压电元件结构的第二表面上。 执行极化操作以向至少一个压电元件结构提供压电特性。 在另一个实施例中，用于厚膜元件的材料沉积到第一基底的表面上以形成厚度大于10um至100μm的厚膜元件结构。 所述至少一个厚膜元件结构被结合到第二基板。 此后，使用包括从辐射源（例如激光或其它合适的装置）发射通过第一基板的光束到形成的附接接口的剥离过程，从至少一个厚膜元件结构中去除第一基板， 在第一基板和第一基板的表面处的至少一个厚膜元件结构之间。 第一衬底在光束的波长处基本上是透明的，并且光束在界面处产生足够的能量以破坏附件。

公开(公告)号：US20040163478A1

公开(公告)日：2004-08-26

申请号：US10376527

申请日：2003-02-25

Applicant: Palo Alto Research Center Incorporated

Inventor： Baomin Xu ,  Steven A. Buhler ,  William S. Wong ,  Michael C. Weisberg ,  Scott E. Solberg ,  Karl A. Littau ,  Scott A. Elrod

IPC: G01L001/00

CPC classification number: G01N29/245 ,  B06B1/0622 ,  G01L1/16 ,  G01N29/2475 ,  G01N2291/02827 ,  G01N2291/2694 ,  H01L27/20 ,  H01L41/313 ,  H01L41/314 ,  H01L41/47

Abstract: A flexible detection/test tape includes a first flexible conductive layer, and a second flexible conductive layer positioned opposite the first conductive layer. A plurality of at least one of sensors, actuators or transducers are positioned between and are bonded to the first flexible conductive layer and the second flexible conductive layer. An insulative material is inserted around the plurality of at least one of the sensors, actuators or transducers. An electrical contact network connects to the first flexible conductive layer and the second flexible conductive layer, whereby power and control signals are provided to the flexible detection/test tape. In an alternative embodiment, a method for producing a detection/test tape includes depositing a material onto a surface of at least one first substrate to form a plurality of element structures. Electrodes are deposited on a surface of each of the plurality of element structures, and the element structures are bonded to a second substrate, where the second substrate is conductive or has a conductive layer, and the second substrate is carried on a carrier plate. The at least one first substrate is removed from the element structures and second side electrodes are deposited on a second surface of each of the plurality of element structures. An insulative material is inserted around the element structures to electrically isolate the two substrates used to bond the element structures. A second side of the element structures is then bonded to another substrate, where the other substrate is conductive or has a conductive layer. Thereafter, the carrier plate carrying the second substrate is removed.

Abstract translation: 柔性检测/测试带包括第一柔性导电层和与第一导电层相对定位的第二柔性导电层。 多个传感器，致动器或换能器中的至少一个位于第一柔性导电层和第二柔性导电层之间并且被结合到第一柔性导电层和第二柔性导电层之间。 绝缘材料插入到多个传感器，致动器或换能器中的至少一个传感器周围。 电接触网络连接到第一柔性导电层和第二柔性导电层，由此向柔性检测/测试带提供电力和控制信号。 在替代实施例中，用于产生检测/测试带的方法包括将材料沉积在至少一个第一基底的表面上以形成多个元件结构。 电极沉积在多个元件结构中的每一个的表面上，并且元件结构被结合到第二衬底，其中第二衬底是导电的或具有导电层，并且第二衬底承载在载体板上。 从元件结构中去除至少一个第一衬底，并且将第二侧电极沉积在多个元件结构中的每一个的第二表面上。 绝缘材料插入在元件结构周围以电隔离用于结合元件结构的两个基板。 然后将元件结构的第二面接合到另一个衬底，其中另一个衬底是导电的或具有导电层。 此后，移除携带第二基板的承载板。

公开(公告)号：US20040113521A1

公开(公告)日：2004-06-17

申请号：US10319138

申请日：2002-12-13

Applicant: Palo Alto Research Center, Incorporated

Inventor： Steven A. Buhler ,  John S. Fitch ,  Meng H. Lean ,  Karl A. Littau

IPC: H02N002/00 ,  H01L041/04

CPC classification number: H01L41/0973 ,  H01L41/1132

Abstract: A system and method of operation is described which utilizes an array of piezoelectric actuators distributed over the surface of a diaphragm. In one embodiment, the piezoelectric actuator array is used to cause a net motion of the diaphragm equal to the sum of the motions of each individual sub-chamber diaphragm. The system can be used as a sensor where a common motion applied to the sub-chamber diaphragm causes a net charge equal to the sum of the charges on each piezoelectric diaphragm.

Abstract translation: 描述了一种使用分布在隔膜表面上的压电致动器阵列的系统和操作方法。 在一个实施例中，压电致动器阵列用于使隔膜的净运动等于每个单独的子室隔膜的运动的总和。 该系统可以用作传感器，其中施加到子室隔膜的共同运动导致等于每个压电振膜上的电荷之和的净电荷。