公开(公告)号：US09964491B2

公开(公告)日：2018-05-08

申请号：US14705343

申请日：2015-05-06

Applicant: PANASONIC CORPORATION

Inventor： Yasuaki Okumura ,  Tatsurou Kawamura ,  Masahiko Shioi ,  Masaru Minamiguchi

IPC: G01N21/65 ,  A61B5/00 ,  A61B5/1455 ,  A61B5/145 ,  A61B5/1459

CPC classification number: G01N21/658 ,  A61B5/0075 ,  A61B5/14503 ,  A61B5/14532 ,  A61B5/1455 ,  A61B5/1459 ,  G01N2201/06113 ,  G01N2201/068 ,  G01N2201/12

Abstract: An exemplary sensor chip includes a substrate, a metal pattern formed on a side of the substrate that is irradiated with excitation light, and a first substance and a second substance provided near the metal pattern. A first intensity Xa of the first surface-enhanced Raman-scattered light from the first substance and a second intensity Xb of the second surface-enhanced Raman-scattered light from the second substance are detected. An intensity ratio Xc, as obtained by dividing the second intensity Xb with the first intensity Xa, is calculated.

公开(公告)号：US09610033B2

公开(公告)日：2017-04-04

申请号：US14951301

申请日：2015-11-24

Applicant: PANASONIC CORPORATION

Inventor： Yasuaki Okumura ,  Tatsurou Kawamura ,  Masaru Minamiguchi ,  Masahiko Shioi

IPC: G01J3/44 ,  A61B5/1459 ,  G01N21/552 ,  G01N21/65

CPC classification number: A61B5/1459 ,  A61B5/0075 ,  A61B5/14532 ,  G01N21/554 ,  G01N21/658

Abstract: An exemplary sensor chip includes a substrate, a metal pattern, a proximate substance, and a light shielding layer. The metal pattern is on the substrate. The proximate substance is on or near the metal pattern. The light shielding layer is provided on the substrate so as to cover the metal pattern and the proximate substance. The light shielding layer is a layer that blocks the excitation light from going into the proximate substance, and is made of a substance which becomes degraded inside a subject.

公开(公告)号：US20150221805A1

公开(公告)日：2015-08-06

申请号：US14596929

申请日：2015-01-14

Applicant: IMEC VZW ,  Panasonic Corporation ,  Katholieke Universiteit Leuven, KU LEUVEN R&D

Inventor： Yasuaki Okumura ,  Hilde Jans ,  Jiaqi Li ,  Masaru Minamiguchi ,  Liesbet Lagae

IPC: H01L31/09 ,  H01L31/0232 ,  H01L31/18

CPC classification number: H01L31/09 ,  A61B5/14532 ,  A61B5/6846 ,  G01N21/554 ,  G01N21/658 ,  H01L31/02327 ,  H01L31/18

Abstract: A method for manufacturing a SERS sensing device (100), the method comprising: providing a silicon substrate (101), creating a silane layer (102) on a surface of the silicon substrate (101), and creating a plurality of plasmonic nanostructures (103) on the silane layer (102), characterized in that: creating a plurality of plasmonic nanostructures (103) on the silane layer (102) comprises completely covering the silane layer (102) with a metallic plasmonic layer (104). Further a SERS sensing device is presented which is implantable.

Abstract translation: 一种用于制造SERS感测装置的方法，所述方法包括：提供硅衬底（101），在所述硅衬底（101）的表面上产生硅烷层（102），以及产生多个等离子体激元纳米结构 103），其特征在于：在所述硅烷层（102）上产生多个等离子体激元纳米结构（103）包括用金属等离子体层（104）完全覆盖所述硅烷层（102）。 此外，还提出了可植入的SERS感测装置。