公开(公告)号：US20180359864A1

公开(公告)日：2018-12-13

申请号：US16003474

申请日：2018-06-08

Applicant: PITYU CONTROLS INC.

Inventor： Stevan DOBI

IPC: H05K3/34 ,  H05K1/18 ,  B23K1/00

CPC classification number: H05K3/3442 ,  B23K1/0016 ,  B23K2101/42 ,  H05K1/181 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/10022 ,  H05K2201/10174 ,  H05K2201/10583 ,  H05K2203/048

Abstract: A cradle for a metal electrode leadless face (MELF) device is provided. The cradle can include at least one pad, such as a solder pad, to be connected to a printed circuit board (PCB) or similar board. The pad can be configured to receive a MELF device. Such a configuration can improve positioning and alignment of the MELF device and prevent or reduce movement of the MELF device prior to or during soldering. The pad can include boundaries to engage the MELF device for alignment and to prevent or reduce movement. The boundaries of the pad can include inlets, extensions, troughs, borders, and/or other features to engage the MELF device. Boards including such cradles are also provided. Further, methods of installing a MELF device on a board using a cradle are also provided.