Abstract:
Optical pump modules comprising VCSEL and VCSEL array devices provide high optical power for configuring fiber optic gain systems such as fiber laser and fiber amplifier particularly suited for high power operation. Pump modules may be constructed using two reflector or three reflector VCSEL devices optionally integrated with microlens arrays and other optical components, to couple high power pump beams to a fiber output port. The pump module having a fiber output port is particularly suited to couple light to an inner cladding of a double-clad fiber, often used to configure high power fiber laser and fiber amplifier. The pump modules may be operated in CW, QCW and pulse modes to configure fiber lasers and amplifiers using single end, dual end, and regenerative optical pumping modes. Multiple-pumps may be combined to increase pump power in a modular fashion without significant distortion to signal, particularly for short pulse operation.
Abstract:
Optical pump modules comprising VCSEL and VCSEL array devices provide high optical power for configuring fiber optic gain systems such as fiber laser and fiber amplifier particularly suited for high power operation. Pump modules may be constructed using two reflector or three reflector VCSEL devices optionally integrated with microlens arrays and other optical components, to couple high power pump beams to a fiber output port. The pump module having a fiber output port is particularly suited to couple light to an inner cladding of a double-clad fiber, often used to configure high power fiber laser and fiber amplifier. The pump modules may be operated in CW, QCW and pulse modes to configure fiber lasers and amplifiers using single end, dual end, and regenerative optical pumping modes. Multiple-pumps may be combined to increase pump power in a modular fashion without significant distortion to signal, particularly for short pulse operation.
Abstract:
A VCSEL illuminator package includes one or more VCSELs in a substrate. The one or more VCSELs are operable to generate a VCSEL output radiation beam. An encapsulant covers the one or more VCSELs, and an optical structure is integrated in the encapsulant. The optical structure is disposed in a path of the VCSEL output radiation beam and is operable to change at least one of a propagation characteristic or intensity distribution of the VCSEL output radiation beam exiting the encapsulant.
Abstract:
A VCSEL illuminator module includes a module forming a physical cavity having electrical contacts positioned on an inner surface of the module that feed through the module to electrical contacts positioned on an outer surface of the module. A VCSEL device is positioned on the inner surface module and includes electrical contacts that are electrically connected to the electrical contacts on the inner surface of the module. The VCSEL device generates an optical beam when current is applied to the electrical contacts. An optical element is positioned adjacent to an emitting surface of the VCSEL device and is configured to modify the optical beam generated by the VCSEL device.
Abstract:
A set of VCSEL fabrication methods has been invented which enhance the performance and long time reliability of VCSEL devices and arrays of devices. Wafer bow caused by growing a large number of epitaxial layers required to fabricate VCSEL device generates strain and results in bowing/warping of the device wafer. The stress so generated is eliminated by applying a stress compensation layer on the substrate to a surface opposite to the epitaxial layer surface. New oxidation equipment designs and process parameters are described which produce more precision apertures and reduce stress in the VCSEL device. An ultrathin fabrication procedure is described which enables high power VCSELs to be made for high power operation at many different wavelengths. A low temperature electrical contacting process improves VCSEL long term reliability.
Abstract:
A process to bond VCSEL arrays to submounts and printed circuit boards is provided. The process is particularly suited to large area thin and ultra-thin VCSEL arrays susceptible to bending and warping. The process integrates a flatness measurement step and applying appropriate combination of pressure prior to bonding the VCSEL array to the submount or a printed circuit using a vacuum flux-less bonding process. The process is very promising in making very good quality bonding between the VCSEL array and a submount or a printed circuit board. The process is applied to construct optical modules with improved flatness that may be integrated with other electronic components in constructing optoelectronic systems.
Abstract:
Optical pump modules comprising VCSEL and VCSEL array devices provide high optical power for configuring fiber optic gain systems such as fiber laser and fiber amplifier particularly suited for high power operation. Pump modules may be constructed using two reflector or three reflector VCSEL devices optionally integrated with microlens arrays and other optical components, to couple high power pump beams to an optical fiber output port, particularly suited to couple light to an inner cladding of a double-clad fiber suitable for a high power gain element. Multiple-pumps may be combined to increase pump power in a modular fashion without significant distortion to signal, particularly for short pulse operation. The pump modules may be operated in CW, QCW and pulse modes to configure fiber lasers and amplifiers using single end, dual end, and regenerative optical pumping modes.
Abstract:
Semiconductor devices, such as vertical-cavity surface-emitting lasers, and methods for manufacturing the same, are disclosed. The semiconductor devices include contact extensions and electrically conductive adhesive material, such as fusible metal alloys or electrically conductive composites. In some instances, the semiconductor devices further include structured contacts. These components enable the production of semiconductor devices having minimal distortion. For example, arrays of vertical-cavity surface-emitting lasers can be produced exhibiting little to no bowing. Semiconductor devices having minimal distortion exhibit enhanced performance in some instances.
Abstract:
A high efficiency optical ignition device is provided in a two-part compact and robust package to be mounted directly on an internal combustion engine chamber. The ignition device ignites a combustion fuel with a high intensity plasma generated by a high power laser beam from a solid state laser operable in Q-switched, or non-Q-switched mode for producing short or long pulses, respectively. Multiple pulses are generated, and duration and frequency of the laser beam pulses are controlled by controlling an optical pump module to pump the solid state laser. The optical pump module comprises a semiconductor laser, preferably a VCSEL device. One or more laser beams are precisely directed, each one to a desired location anywhere within the combustion chamber for more efficient and near complete burning of the combustion fuel. The robust packaging is well suited to withstand mechanical and thermal stresses of the internal combustion engine.
Abstract:
A process to bond VCSEL arrays to submounts and printed circuit boards is provided. The process is particularly suited to large area thin and ultra-thin VCSEL arrays susceptible to bending and warping. The process integrates a flatness measurement step and applying appropriate combination of pressure prior to bonding the VCSEL array to the submount or a printed circuit using a vacuum flux-less bonding process. The process is very promising in making very good quality bonding between the VCSEL array and a submount or a printed circuit board. The process is applied to construct optical modules with improved flatness that may be integrated with other electronic components in constructing optoelectronic systems.