公开(公告)号：US10109459B1

公开(公告)日：2018-10-23

申请号：US15683835

申请日：2017-08-23

Applicant: PSK INC.

Inventor： Han Saem Rhee ,  Sung Jin Yoon ,  Dong Hoon Kim

IPC: H01J37/32

Abstract: Disclosed are a substrate treating The substrate treating apparatus includes a plasma generating unit the plasma generating unit includes a plasma generating chamber having a space, into which a gas is introduced, a first antenna wound to surround the plasma generating chamber and connected to a power source through a first electric wire, a second antenna wound to surround the housing and connected to the power source through a second electric wire to be disposed in parallel to the first antenna, and power distributing members provided in the first antenna and the second antenna to distribute electric power supplied from the power source to the first antenna and the second antenna.