SUBSTRATE PROCESSING APPARATUS
    1.
    发明公开

    公开(公告)号:US20240194445A1

    公开(公告)日:2024-06-13

    申请号:US18284657

    申请日:2021-12-16

    Applicant: PSK INC.

    CPC classification number: H01J37/321 H01J37/3244 H01J37/32798 H01J2237/3323

    Abstract: Provided is an apparatus for processing a substrate, the apparatus including: a chamber having a processing space; a support unit for supporting a substrate in the processing space; a gas supply unit for supplying process gas to the processing space; and a plasma generation unit for generating plasma from the process gas, in which the plasma generation unit includes: an inner coil part including a plurality of inner coils; an outer coil part provided to surround the inner coil part when viewed from above and including a plurality of outer coils; an upper power source for applying power to the inner coil part and the outer coil part, and a ground plate disposed above the inner coil part and the outer coil part and grounding the inner coil part and the outer coil part.

Patent Agency Ranking