公开(公告)号：US20240297023A1

公开(公告)日：2024-09-05

申请号：US18026528

申请日：2021-12-02

Applicant: PSK INC.

Inventor： Kwang Sung YOO ,  Jong Chan LEE ,  Seong Min NAM

IPC: H01J37/32 ,  H01L21/683

CPC classification number: H01J37/32568 ,  H01J37/3244 ,  H01J37/32715 ,  H01L21/6831 ,  H01J2237/2007 ,  H01J2237/334

Abstract: A substrate processing apparatus is provided. The substrate processing apparatus includes a housing having an interior space, a lower electrode unit supporting a substrate in the interior space, an upper electrode unit facing the lower electrode unit, and a gas supply unit supplying a process gas to the interior space, wherein the upper electrode unit includes a dielectric plate facing an upper surface of the substrate supported by the lower electrode unit, a support body supporting the dielectric plate, wherein the support body and the dielectric plate are combined with each other to form a buffer space and the gas supply unit supplies the process gas to the interior space via the buffer space, and a baffle ring disposed on a flow path of the process gas flowing from the buffer space to the interior space.