公开(公告)号：US20190223318A1

公开(公告)日：2019-07-18

申请号：US16235224

申请日：2018-12-28

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Akio INOUE ,  Hideyuki FUKUDA

IPC: H05K7/20 ,  F21S41/14 ,  H05K1/18 ,  H05K1/02 ,  F21V29/508 ,  F21V29/76 ,  H05K5/00

CPC classification number: H05K7/209 ,  F21S41/14 ,  F21V29/508 ,  F21V29/76 ,  H05K1/0203 ,  H05K1/181 ,  H05K5/0008 ,  H05K2201/066 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10409 ,  H05K2201/10522

Abstract: A power supply device includes a covering member, at least one high-height component, and at least one low-height component lower than the high-height component. The covering member includes a reference surface, at least one concave portion recessed from the reference surface toward a side opposite to a side of a circuit board in a Z direction, and at least one convex portion projecting from the reference surface toward the side of the circuit board in the Z direction. The at least one high-height component includes at least one high-height thermally connecting component, a tip end portion of which is thermally connected to a bottom surface of the concave portion, and the at least one low-height component includes at least one low-height thermally connecting component, a tip end portion of which is thermally connected to a tip end surface of the convex portion.