公开(公告)号：US20200224886A1

公开(公告)日：2020-07-16

申请号：US16818442

申请日：2020-03-13

Applicant: PixArt Imaging Inc.

Inventor： Chih-Ming SUN ,  Ming-Han TSAI ,  Chiung-Wen LIN ,  Po-Wei YU ,  Wei-Ming WANG ,  Sen-Huang HUANG

IPC: F24C15/20 ,  G01J5/10 ,  G01J5/00 ,  A61F13/42 ,  B66B5/00

Abstract: There is provided an auto detection system including a thermal detection device and a host. The host controls an indication device to indicate a prompt message or detection results according to a slope variation of voltage values or 2D distribution of temperature values detected by the thermal detection device, wherein the voltage values include the detected voltage of a single pixel or the sum of detected voltages of multiple pixels of a thermal sensor.

公开(公告)号：US20190241426A1

公开(公告)日：2019-08-08

申请号：US15891975

申请日：2018-02-08

Applicant: PixArt Imaging Inc.

Inventor： Chih-Ming SUN ,  Ming-Han TSAI ,  Yu-Tao LEE

IPC: B81B3/00 ,  H01L27/146 ,  H01L23/00 ,  B81C1/00

CPC classification number: B81B3/0021 ,  B81B2201/033 ,  B81B2203/0109 ,  B81B2203/0172 ,  B81B2203/04 ,  B81B2203/051 ,  B81B2203/055 ,  B81B2207/07 ,  B81C1/00142 ,  H01L24/16 ,  H01L27/14636 ,  H01L2224/16245 ,  H01L2924/1461

Abstract: A sensor package including a fixed frame, a moveable platform, elastic restoring members and a sensor chip is provided. The moveable platform is moved with respect to the fixed frame, and used to carry the sensor chip. The elastic restoring members are connected between the fixed frame and the moveable platform, and used to restore the moved moveable platform to an original position. The sensor chip is arranged on the elastic restoring members to send detected data via the elastic restoring members.

公开(公告)号：US20230031112A1

公开(公告)日：2023-02-02

申请号：US17739780

申请日：2022-05-09

Applicant: PIXART IMAGING INC.

Inventor： Ming-Han TSAI ,  Chih-Fan HU

IPC: H01L27/16 ,  H01L35/34 ,  H01L35/30 ,  G01J5/14

Abstract: There is provided a far infrared (FIR) sensor device including a substrate, a thermopile structure and a heat absorption layer. The thermopile structure is arranged on the substrate. The heat absorption layer covers upon the thermopile structure, wherein the heat absorption layer has a hollow space which is formed by etching a metal layer in the heat absorption layer.