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公开(公告)号：US20220317335A1
公开(公告)日：2022-10-06
申请号：US17713850
申请日：2022-04-05
Applicant: Purdue Research Foundation
Inventor： Vladimir M. Shalaev , Alexandra Boltasseva , Alexei Lagutchev , Alexander Senichev , Zachariah O. Martin , Demid Sychev , Samuel Peana , Xiaohui Xu
Abstract: A photon emitter includes a multi-layer film. The multi-layer film includes a first material layer and a second material layer, and the multi-layer film includes an interface surface between the first and second material layers. The first material layer includes silicon nitride. The multi-layer film is formed by positioning the silicon nitride over the second material layer and energetically activating the combination of the first material layer and the second material layer. The interface surface is operable to emit single photons.
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公开(公告)号：US20230177642A1
公开(公告)日：2023-06-08
申请号：US17858722
申请日：2022-07-06
Applicant: Purdue Research Foundation
Inventor： Zhaxylyk A. Kudyshev , Demid Sychev , Zachariah Olson Martin , Simeon I. Bogdanov , Xiaohui Xu , Alexander Kildishev , Alexandra Boltasseva , Vladimir Shalaev
CPC classification number: G06T3/4053 , G06T3/4046 , G02B21/0072
Abstract: A method of providing super-resolved images of a photon emitting particle is disclosed, which includes providing a machine-learning (ML) platform, wherein the ML platform is configured to receive pixel-based sparse autocorrelation data and generate a predicted super-resolved image of a photon emitting particle, receiving photons from the photon emitting particle by two or more photon detectors, each generating an electrical pulse associated with receiving an incident photon thereon, generating sparse autocorrelation data from the two or more photon detectors for each pixel within an image area, and inputting the pixel-based sparse autocorrelation data to the ML platform, thereby generating a predicted super-resolved image of the imaging area, wherein the resolution of the super-resolved image is improved by √n as compared to a classical optical microscope limited by Abbe diffraction limit.
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公开(公告)号：US12159369B2
公开(公告)日：2024-12-03
申请号：US17858722
申请日：2022-07-06
Applicant: Purdue Research Foundation
Inventor： Zhaxylyk A. Kudyshev , Demid Sychev , Zachariah Olson Martin , Simeon I. Bogdanov , Xiaohui Xu , Alexander Kildishev , Alexandra Boltasseva , Vladimir Shalaev
IPC: G06T3/40 , G02B21/00 , G06T3/4046 , G06T3/4053
Abstract: A method of providing super-resolved images of a photon emitting particle is disclosed, which includes providing a machine-learning (ML) platform, wherein the ML platform is configured to receive pixel-based sparse autocorrelation data and generate a predicted super-resolved image of a photon emitting particle, receiving photons from the photon emitting particle by two or more photon detectors, each generating an electrical pulse associated with receiving an incident photon thereon, generating sparse autocorrelation data from the two or more photon detectors for each pixel within an image area, and inputting the pixel-based sparse autocorrelation data to the ML platform, thereby generating a predicted super-resolved image of the imaging area, wherein the resolution of the super-resolved image is improved by √n as compared to a classical optical microscope limited by Abbe diffraction limit.
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公开(公告)号：US20220406962A1
公开(公告)日：2022-12-22
申请号：US17845093
申请日：2022-06-21
Applicant: Purdue Research Foundation
Inventor： Xiaohui Xu , Zachariah Olson Martin , Demid Sychev , Alexei S. Lagutchev , Yong Chen , Vladimir Michael Shalaev , Alexandra Boltasseva
Abstract: Methods of fabricating single photon emitters (SPEs) including nanoindentation of hexagonal boron nitride (hBN) host materials and annealing thereof, devices formed from such methods, and chips with a single photon emitter. A substrate with a layer of hBN is provided. Nanoindentation is performed on the layer of hBN to produce an array of sub-micron indentations in the layer of hBN. The layer of hBN is annealed to activate SPEs near the indentations. Devices include a substrate with an SPE produced in accordance with the methods. Chips include a substrate, an hBN layer, and an SPE including an indentation on the hBN layer, in which the substrate is not damaged at the indentation.
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