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    Apparatus and method for monitoring a package during transit
    4.
    发明授权
    Apparatus and method for monitoring a package during transit 有权

    公开(公告)号：US10332063B2

    公开(公告)日：2019-06-25

    申请号：US16007620

    申请日：2018-06-13

    Applicant: R.R. DONNELLEY & SONS COMPANY

    Inventor： Theodore F. Cyman, Jr. ,  Alan R. Murzynowski ,  Daniel E. Kanfoush ,  James L. Warmus ,  Eric V. Palmer

    IPC: G06Q10/08 ,  G06K19/07 ,  G06K7/10

    Abstract: According to one aspect, a monitoring device includes a processor, a sensor, and a configuration circuit. The sensor is adapted to detect if the sensor is subjected to at least a first magnitude of the particular condition. The configuration circuit may be used to specify a second magnitude of the particular condition, wherein the second magnitude is greater than the first magnitude. The processor remains in an inactive state if the object is subjected to a magnitude of the particular condition less than the second magnitude, and the sensor generates a signal in response to detection of sensor being subjected to at least the second magnitude of the particular condition. In response to the signal, the processor enters an active state to develop an indication of at least the second magnitude of the particular condition.

    METHOD AND APPARATUS FOR PRODUCING AN ELECTRONIC DEVICE
    6.
    发明申请
    METHOD AND APPARATUS FOR PRODUCING AN ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20180285707A1

    公开(公告)日：2018-10-04

    申请号：US16002541

    申请日：2018-06-07

    Applicant: R.R. DONNELLEY & SONS COMPANY

    Inventor： Theodore F. Cyman, JR. ,  Alan R. Murzynowski ,  Daniel E. Kanfoush

    IPC: G06K19/077 ,  H05K3/04

    Abstract: A method and apparatus for producing an electronic device are disclosed. An adhesive material is jetted in a first pattern on a surface of a receiver substrate. A carrier having a metal foil disposed thereon is brought into contact with the first substrate such that a portion of the metal foil contacts the adhesive material. The adhesive material is activated using at least one of mechanical pressure and heat while the portion of the metal foil is in contact with the adhesive material. The first substrate and the second substrate are separated, whereby the portion of the metal foil is transferred to the first substrate.

    METHOD AND APPARATUS FOR PRODUCING AN ELECTRONIC DEVICE
    7.
    发明申请
    METHOD AND APPARATUS FOR PRODUCING AN ELECTRONIC DEVICE 有权
    用于生产电子设备的方法和装置

    公开(公告)号：US20160050762A1

    公开(公告)日：2016-02-18

    申请号：US14825986

    申请日：2015-08-13

    Applicant: R.R. DONNELLEY & SONS COMPANY

    Inventor： Theodore F. Cyman, JR. ,  Alan R. Murzynowski ,  Daniel E. Kanfoush

    IPC: H05K3/12 ,  H05K3/00 ,  H05K3/40

    CPC classification number: G06K19/077 ,  H05K1/115 ,  H05K3/046 ,  H05K3/4685 ,  H05K2201/10098 ,  H05K2203/0522 ,  H05K2203/1545

    Abstract: A method and apparatus for producing an electronic device are disclosed. An adhesive material is jetted in a first pattern on a surface of a receiver substrate. A carrier having a metal foil disposed thereon is brought into contact with the first substrate such that a portion of the metal foil contacts the adhesive material. The adhesive material is activated using at least one of mechanical pressure and heat while the portion of the metal foil is in contact with the adhesive material. The first substrate and the second substrate are separated, whereby the portion of the metal foil is transferred to the first substrate.

    Abstract translation: 公开了一种用于制造电子装置的方法和装置。 在接收器基板的表面上以第一图案喷射粘合材料。 使其上设置有金属箔的载体与第一基板接触，使得金属箔的一部分接触粘合剂材料。 粘合剂材料使用机械压力和热量中的至少一种来活化，同时金属箔的部分与粘合剂材料接触。 分离第一基板和第二基板，由此将金属箔的一部分转印到第一基板。

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