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公开(公告)号：US20170042027A1
公开(公告)日：2017-02-09
申请号：US15296198
申请日：2016-10-18
Applicant: RAYTHEON COMPANY
Inventor： Peter D. Morico , John D. Walker
CPC classification number: H05K1/142 , H05K1/0209 , H05K3/32 , H05K3/36 , H05K2201/066 , Y10T29/49126
Abstract: A hybrid circuit assembly includes an integrated metal substrate (IMS) having high-voltage, high-power components mounted thereon. The IMS includes a metal base plate an insulating adhesive on the metal base plate, and one or more wiring layers on the insulating adhesive. The hybrid circuit assembly includes a multi-layer printed wiring board (PWB) having low-voltage, low-power components mounted thereon. The multi-layer PWB is connected to the IMS and has an upper surface that is co-planar with an upper surface of the IMS. The PWB is mounted on the metal base plate via the insulating adhesive.
Abstract translation: 混合电路组件包括其上安装有高电压，大功率部件的集成金属基板（IMS）。 IMS在金属基板上包括金属基板和绝缘粘合剂，以及绝缘粘合剂上的一个或多个布线层。 混合电路组件包括其上安装有低电压，低功率元件的多层印刷电路板（PWB）。 多层PWB连接到IMS并具有与IMS的上表面共面的上表面。 PWB通过绝缘粘合剂安装在金属基板上。
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Patent Agency Ranking
公开(公告)号：US09504157B2
公开(公告)日：2016-11-22
申请号：US14016806
申请日：2013-09-03
Applicant: RAYTHEON COMPANY
Inventor： Peter D. Morico , John D. Walker
CPC classification number: H05K1/142 , H05K1/0209 , H05K3/32 , H05K3/36 , H05K2201/066 , Y10T29/49126
Abstract: A hybrid circuit assembly includes an integrated metal substrate (IMS) having high-voltage, high-power components mounted thereon. The IMS includes a metal base plate an insulating adhesive on the metal base plate, and one or more wiring layers on the insulating adhesive. The hybrid circuit assembly includes a multi-layer printed wiring board (PWB) having low-voltage, low-power components mounted thereon. The multi-layer PWB is connected to the IMS and has an upper surface that is co-planar with an upper surface of the IMS. The PWB is mounted on the metal base plate via the insulating adhesive.
Abstract translation: 混合电路组件包括其上安装有高电压，大功率部件的集成金属基板（IMS）。 IMS在金属基板上包括金属基板和绝缘粘合剂，以及绝缘粘合剂上的一个或多个布线层。 混合电路组件包括其上安装有低电压，低功率元件的多层印刷电路板（PWB）。 多层PWB连接到IMS并具有与IMS的上表面共面的上表面。 PWB通过绝缘粘合剂安装在金属基板上。
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公开(公告)号：US11863062B2
公开(公告)日：2024-01-02
申请号：US15965070
申请日：2018-04-27
Applicant: Raytheon Company
Inventor： Benjamin J. Snyder , Erin K. Nolan , Aline Elad , John D. Walker
Abstract: A capacitor discharge circuit for discharging a capacitor to a discharge load. The discharge circuity includes current level sensing circuitry for producing a control signal circuity response to current passing to the discharge load. The discharge circuity modulates a level of current passing from the capacitor to the discharge load over time between predetermined ranges of current levels in response to the control signal.
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公开(公告)号：US20190334363A1
公开(公告)日：2019-10-31
申请号：US15965070
申请日：2018-04-27
Applicant: Raytheon Company
Inventor： Benjamin J. Snyder , Erin K. Nolan , Aline Elad , John D. Walker
IPC: H02J7/00
Abstract: A capacitor discharge circuit for discharging a capacitor to a discharge load. The discharge circuity includes current level sensing circuitry for producing a control signal circuity response to current passing to the discharge load. The discharge circuity modulates a level of current passing from the capacitor to the discharge load over time between predetermined ranges of current levels in response to the control signal.
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公开(公告)号：US10219375B2
公开(公告)日：2019-02-26
申请号：US15296198
申请日：2016-10-18
Applicant: RAYTHEON COMPANY
Inventor： Peter D. Morico , John D. Walker
Abstract: A hybrid circuit assembly includes an integrated metal substrate (IMS) having high-voltage, high-power components mounted thereon. The IMS includes a metal base plate an insulating adhesive on the metal base plate, and one or more wiring layers on the insulating adhesive. The hybrid circuit assembly includes a multi-layer printed wiring board (PWB) having low-voltage, low-power components mounted thereon. The multi-layer PWB is connected to the IMS and has an upper surface that is co-planar with an upper surface of the IMS. The PWB is mounted on the metal base plate via the insulating adhesive.
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公开(公告)号：US20150062855A1
公开(公告)日：2015-03-05
申请号：US14016806
申请日：2013-09-03
Applicant: RAYTHEON COMPANY
Inventor： Peter D. Morico , John D. Walker
CPC classification number: H05K1/142 , H05K1/0209 , H05K3/32 , H05K3/36 , H05K2201/066 , Y10T29/49126
Abstract: A hybrid circuit assembly includes an integrated metal substrate (IMS) having high-voltage, high-power components mounted thereon. The IMS includes a metal base plate an insulating adhesive on the metal base plate, and one or more wiring layers on the insulating adhesive. The hybrid circuit assembly includes a multi-layer printed wiring board (PWB) having low-voltage, low-power components mounted thereon. The multi-layer PWB is connected to the IMS and has an upper surface that is co-planar with an upper surface of the IMS. The PWB is mounted on the metal base plate via the insulating adhesive.
Abstract translation: 混合电路组件包括其上安装有高电压，大功率部件的集成金属基板（IMS）。 IMS在金属基板上包括金属基板和绝缘粘合剂，以及绝缘粘合剂上的一个或多个布线层。 混合电路组件包括其上安装有低电压，低功率元件的多层印刷电路板（PWB）。 多层PWB连接到IMS并具有与IMS的上表面共面的上表面。 PWB通过绝缘粘合剂安装在金属基板上。
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