Thermal energy absorbing structures

    公开(公告)号:US11150065B2

    公开(公告)日:2021-10-19

    申请号:US15342011

    申请日:2016-11-02

    Abstract: Thermally-sensitive hardware is at least partially enclosed within a container in which reactants for a solid-solid endothermic chemical reaction are disposed, surrounding at least a portion of the thermally-sensitive hardware. The reactants or a structure including the reactants are positioned between the thermally-sensitive hardware and a heat source, such as an external surface of a missile traveling through atmospheric gases at extremely high speed and experiencing extreme frictional heating. The reactants absorb heat during the solid-solid endothermic reaction to thermally protect the thermally-sensitive hardware. The reactants are preferably selected to absorb heat of at least 5 kilo-Joules per gram (kJ/g) during the solid-solid endothermic chemical reaction.

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