Vertical Radio Frequency Module
    1.
    发明申请
    Vertical Radio Frequency Module 有权
    垂直射频模块

    公开(公告)号:US20160174357A1

    公开(公告)日:2016-06-16

    申请号:US14565744

    申请日:2014-12-10

    Abstract: A radio frequency (RF) module having a plurality of channels includes a heat sink having at least one tapered edge; a substrate disposed over a surface of the heat sink such that the tapered edge of the heat sink extends past a boundary of the substrate. RF, logic and power circuitry is disposed on the substrate and one or more RF signal ports are formed on an edge of the substrate to allow the RF module to be used in an array antenna having a brick architecture. The tapered edge heat sink provides both a ground plane for RF signal components and a thermal path for heat generating circuits disposed in the substrate.

    Abstract translation: 具有多个通道的射频(RF)模块包括具有至少一个锥形边缘的散热器; 衬底,其布置在所述散热器的表面上,使得所述散热片的锥形边缘延伸超过所述衬底的边界。 RF,逻辑和电源电路设置在衬底上,并且一个或多个RF信号端口形成在衬底的边缘上,以允许RF模块用于具有砖结构的阵列天线。 锥形边缘散热器为RF信号部件提供接地平面,并为设置在基板中的发热电路提供热路径。

    Vertical radio frequency module
    2.
    发明授权
    Vertical radio frequency module 有权
    垂直射频模块

    公开(公告)号:US09402301B2

    公开(公告)日:2016-07-26

    申请号:US14565744

    申请日:2014-12-10

    Abstract: A radio frequency (RF) module having a plurality of channels includes a heat sink having at least one tapered edge; a substrate disposed over a surface of the heat sink such that the tapered edge of the heat sink extends past a boundary of the substrate. RF, logic and power circuitry is disposed on the substrate and one or more RF signal ports are formed on an edge of the substrate to allow the RF module to be used in an array antenna having a brick architecture. The tapered edge heat sink provides both a ground plane for RF signal components and a thermal path for heat generating circuits disposed in the substrate.

    Abstract translation: 具有多个通道的射频(RF)模块包括具有至少一个锥形边缘的散热器; 衬底,其布置在所述散热器的表面上,使得所述散热片的锥形边缘延伸超过所述衬底的边界。 RF,逻辑和电源电路设置在衬底上,并且一个或多个RF信号端口形成在衬底的边缘上,以允许RF模块用于具有砖结构的阵列天线。 锥形边缘散热器为RF信号部件提供接地平面,并为设置在基板中的发热电路提供热路径。

Patent Agency Ranking