公开(公告)号：US09955586B2

公开(公告)日：2018-04-24

申请号：US14800751

申请日：2015-07-16

Applicant: REALTEK SEMICONDUCTOR CORP.

Inventor： Ting-Ying Wu ,  Cheng-Lin Wu ,  Chin-Yuan Lo ,  Wen-Shan Wang

IPC: H05K7/10 ,  H05K3/34 ,  H01L23/498 ,  H01L23/50 ,  H05K7/00 ,  H05K7/12 ,  H05K1/02

CPC classification number: H05K3/3436 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/50 ,  H01L2924/0002 ,  H05K1/0215 ,  H05K1/0289 ,  H05K2201/10159 ,  H05K2201/10704 ,  H05K2201/10712 ,  H05K2201/10719 ,  H05K2201/10734 ,  Y02P70/613 ,  H01L2924/00

Abstract: A Ball Grid Array (BGA) formed on printed circuit board is provided. The BGA comprises a first solder ball module and a second solder ball module. The first solder ball module comprises a plurality of first solder balls, wherein one of the first solder balls is grounded for shielding two other first solder balls, and one of the first solder balls is floating. The second solder ball module comprises a plurality of second solder balls, wherein two of the second solder balls are grounded and one of the two grounded second solder balls penetrates the printed circuit board through a plated through hole formed on the printed circuit board for shielding two first solder balls among the first solder balls.