公开(公告)号：US12071339B2

公开(公告)日：2024-08-27

申请号：US17294615

申请日：2019-12-13

Applicant: RF360 SINGAPORE PTE. LTD.

Inventor： Manuel Hofer ,  Rodrigo Pacher Fernandes ,  Stefan Leopold Hatzl ,  Josef Ehgartner ,  Peter Bainschab

IPC: B81B7/00 ,  B81C1/00 ,  H03H3/007 ,  H03H9/17

CPC classification number: B81B7/0051 ,  B81C1/00269 ,  H03H3/007 ,  H03H9/171 ,  B81B2201/0271 ,  B81B2207/053 ,  B81C2203/0118 ,  B81C2203/037

Abstract: A wafer-level package for micro-acoustic devices and a method of manufacture is provided. The package comprises a base wafer with electric device structures. A frame structure is sitting on top of the base wafer enclosing particular device areas for the micro-acoustic devices. A cap wafer provided with a thin polymer coating is bonded to the frame structure to form a closed cavity over each device area and to enclose within the cavity the device structures arranged on the respective device area.