公开(公告)号：US06329631B1

公开(公告)日：2001-12-11

申请号：US09390638

申请日：1999-09-07

Applicant: Ray Yueh

Inventor： Ray Yueh

IPC: B23K2620

CPC classification number: H05K3/3484 ,  B23K3/06 ,  B23K35/0222 ,  B23K35/025 ,  B23K2101/40 ,  H05K3/3478 ,  H05K2201/09945 ,  H05K2201/10424 ,  H05K2203/0338 ,  H05K2203/107

Abstract: A transparent plastic solder strip being provided with a plurality of solder holes for each accommodating an amount of solder paste therein. These solder holes have a very small diameter and are uniformly and densely distributed throughout the solder strip in a specific pattern, such that a proper density of the solder hole on the solder strip is obtained to always allow sufficient number of solder holes to be covered in an applied area for sufficient amount of solder paste to be melted by laser beams and transferred from the solder strip to islands on a BGA carrier for bonding the carrier to a semiconductor device. It is no longer necessary to register the solder holes with the islands on the carrier to complete the solder transfer.

Abstract translation: 一个透明的塑料焊料条被提供有多个焊接孔，用于每个焊料孔容纳一定数量的焊膏。 这些焊接孔具有非常小的直径，并且以特定图案均匀且密集地分布在整个焊料条中，使得获得焊料条上的焊料孔的适当密度，以便始终允许足够数量的焊料孔被覆盖 用于通过激光束熔化足够量的焊膏并将其从焊料条转移到BGA载体上的岛以将载体接合到半导体器件的施加区域。 不再需要在载体上的岛上注册焊锡孔，以完成焊料传输。