公开(公告)号：US09323130B2

公开(公告)日：2016-04-26

申请号：US14170348

申请日：2014-01-31

Applicant: Raytheon Company

Inventor： Jeffrey P. Yanevich ,  Michael L. Brest ,  Kenneth L. McAllister ,  James E. Scroggin ,  Gregory D. Tracy ,  Julio C. Dominguez

IPC: G03B9/08 ,  G01J5/08 ,  G03B9/02 ,  G01J3/12 ,  G01J3/28 ,  G01J3/32 ,  G01J5/02 ,  G01J5/06 ,  G01J5/62 ,  G01J3/02

CPC classification number: G03B9/08 ,  G01J3/0224 ,  G01J3/12 ,  G01J3/2823 ,  G01J3/32 ,  G01J5/0205 ,  G01J5/0275 ,  G01J5/061 ,  G01J5/0831 ,  G01J5/084 ,  G01J5/62 ,  G01J2003/1243 ,  G01J2003/2826 ,  G03B9/02 ,  G03B9/40 ,  G03B2205/0046

Abstract: A shutter assembly comprising a first planar member and a second planar member opposed from one another and forming a sleeve having a cavity therebetween, the sleeve having a pair of side rails adjacent the cavity along sides of the sleeve. A first shutter member having a first end is disposed in the cavity and slidingly disposed along one of the side rails, and a second shutter member having a second end is disposed in the cavity and slidingly disposed along the other side rail. The first end is opposed to the second end and is configured to be selectively advanced towards, and retracted from, the second end so as to define an aperture therebetween having a first shape when disposed in a first position, and wherein the aperture has a second larger shape when the first end is disposed in a second position. The first shutter member and the second shutter member maintain a thermal contact with the side rails and the planar members in all positions. The shutter assembly is well suited to be used at a cryogenic temperature and in a high vacuum environment.

Abstract translation: 一种快门组件，包括第一平面构件和第二平面构件，所述第一平面构件和第二平面构件彼此相对并且形成在其间具有空腔的套筒，所述套筒具有沿着所述套筒的侧面与所述空腔相邻的一对侧轨。 具有第一端的第一闸门构件设置在空腔中并且沿着一个侧轨滑动地设置，并且具有第二端的第二闸门构件设置在空腔中并沿另一侧轨滑动设置。 所述第一端与所述第二端相对，并且被配置为选择性地朝向所述第二端并朝向所述第二端缩回，以便当其设置在第一位置时具有第一形状并且其中所述孔具有第二端 当第一端设置在第二位置时，形状较大。 第一挡板构件和第二挡板构件在所有位置保持与侧轨和平面构件的热接触。 快门组件非常适合在低温和高真空环境中使用。

公开(公告)号：US10410760B2

公开(公告)日：2019-09-10

申请号：US15194427

申请日：2016-06-27

Applicant: Raytheon Company

Inventor： Jay R. Neumann ,  Thomas F. McEwan ,  David E. Sigurdson ,  Alberto Perez ,  Janine F. Lambe ,  Gregory D. Tracy

IPC: H01B7/04 ,  H05K5/00 ,  H05K1/02 ,  H01R12/79 ,  H01L27/146 ,  G06F13/20 ,  H01P3/08 ,  H04N5/225 ,  H05K3/46 ,  H04M1/02

Abstract: A rigid-flex assembly (RFA) includes a circuit board attachable to a focal plane sensor. The RFA includes a flexible wiring section electrically coupled at opposing ends to the circuit board and to an edge connector. The flexible wiring section has a controlled separation distance or volume or vacuum gap between wiring strips for reduction of dielectric electrical loss and electrical cross talk. The flexible section has wires or traces configured to reduce the amount of copper used while optimizing signal integrity. Rigid substrates electrically couple the flexible wiring section to the connector. The RFA uses an end-launch, in-plane connection to the sensor for improved performance. A sensor module includes a housing and a sensor. An RFA is coupled to the sensor for high-speed data transfer and that optimizes signal integrity while providing thermal isolation via the flexible section.

公开(公告)号：US20140363151A1

公开(公告)日：2014-12-11

申请号：US14170348

申请日：2014-01-31

Applicant: Raytheon Company

Inventor： Jeffrey P. Yanevich ,  Michael L. Brest ,  Kenneth L. McAllister ,  James E. Scroggin ,  Gregory D. Tracy ,  Julio C. Dominguez

IPC: G03B9/08

CPC classification number: G03B9/08 ,  G01J3/0224 ,  G01J3/12 ,  G01J3/2823 ,  G01J3/32 ,  G01J5/0205 ,  G01J5/0275 ,  G01J5/061 ,  G01J5/0831 ,  G01J5/084 ,  G01J5/62 ,  G01J2003/1243 ,  G01J2003/2826 ,  G03B9/02 ,  G03B9/40 ,  G03B2205/0046

Abstract: A shutter assembly comprising a first planar member and a second planar member opposed from one another and forming a sleeve having a cavity therebetween, the sleeve having a pair of side rails adjacent the cavity along sides of the sleeve. A first shutter member having a first end is disposed in the cavity and slidingly disposed along one of the side rails, and a second shutter member having a second end is disposed in the cavity and slidingly disposed along the other side rail. The first end is opposed to the second end and is configured to be selectively advanced towards, and retracted from, the second end so as to define an aperture therebetween having a first shape when disposed in a first position, and wherein the aperture has a second larger shape when the first end is disposed in a second position. The first shutter member and the second shutter member maintain a thermal contact with the side rails and the planar members in all positions. The shutter assembly is well suited to be used at a cryogenic temperature and in a high vacuum environment.

Abstract translation: 一种快门组件，包括第一平面构件和第二平面构件，所述第一平面构件和第二平面构件彼此相对并且形成在其间具有空腔的套筒，所述套筒具有沿着所述套筒的侧面与所述空腔相邻的一对侧轨。 具有第一端的第一闸门构件设置在空腔中并且沿着一个侧轨滑动地设置，并且具有第二端的第二闸门构件设置在空腔中并沿着另一侧轨滑动设置。 所述第一端与所述第二端相对，并且被配置为选择性地朝向所述第二端并朝向所述第二端缩回，以便当其设置在第一位置时具有第一形状并且其中所述孔具有第二端 当第一端设置在第二位置时，形状较大。 第一挡板构件和第二挡板构件在所有位置保持与侧轨和平面构件的热接触。 快门组件非常适合在低温和高真空环境中使用。

公开(公告)号：US09708181B2

公开(公告)日：2017-07-18

申请号：US15048106

申请日：2016-02-19

Applicant: Raytheon Company

Inventor： Adam M. Kennedy ,  Buu Q. Diep ,  Stephen H. Black ,  Tse E. Wong ,  Thomas Allan Kocian ,  Gregory D. Tracy

IPC: H01L21/50 ,  B81C1/00 ,  B81B7/00

CPC classification number: B81C1/00333 ,  B81B7/0048 ,  B81B7/0051 ,  B81B2201/0207 ,  B81C1/00825 ,  B81C2203/035

Abstract: A sealed package having a device disposed on a wafer structure and a lid structure boned to the device wafer. The device wafer includes: a substrate; a metal ring disposed on a surface portion of substrate around the device and a bonding material disposed on the metal ring. The metal ring extends laterally beyond at least one of an inner and outer edge of the bonding material. A first layer of the metal ring includes a stress relief buffer layer having a higher ductility than that of the surface portion of the substrate and a width greater than the width of the bonding material. The metal ring extends laterally beyond at least one of the inner and outer edges of the bonding material. The stress relief buffer layer has a coefficient of thermal expansion greater than the coefficient of expansion of the surface portion of the substrate and less than the coefficient of expansion of the bonding material.

公开(公告)号：US20170200529A1

公开(公告)日：2017-07-13

申请号：US15194427

申请日：2016-06-27

Applicant: Raytheon Company

Inventor： Jay R. Neumann ,  Thomas F. McEwan ,  David E. Sigurdson ,  Alberto Perez ,  Janine F. Lambe ,  Gregory D. Tracy

IPC: H01B7/04 ,  G06F13/20 ,  H01R12/79 ,  H01L27/146 ,  H05K5/00 ,  H05K1/02

Abstract: A rigid-flex assembly (RFA) includes a circuit board attachable to a focal plane sensor. The RFA includes a flexible wiring section electrically coupled at opposing ends to the circuit board and to an edge connector. The flexible wiring section has a controlled separation distance or volume or vacuum gap between wiring strips for reduction of dielectric electrical loss and electrical cross talk. The flexible section has wires or traces configured to reduce the amount of copper used while optimizing signal integrity. Rigid substrates electrically couple the flexible wiring section to the connector. The RFA uses an end-launch, in-plane connection to the sensor for improved performance. A sensor module includes a housing and a sensor. An RFA is coupled to the sensor for high-speed data transfer and that optimizes signal integrity while providing thermal isolation via the flexible section.

公开(公告)号：US20160167959A1

公开(公告)日：2016-06-16

申请号：US15048106

申请日：2016-02-19

Applicant: Raytheon Company

Inventor： Adam M. Kennedy ,  Buu Q. Diep ,  Stephen H. Black ,  Tse E. Wong ,  Thomas Allan Kocian ,  Gregory D. Tracy

IPC: B81C1/00

CPC classification number: B81C1/00333 ,  B81B7/0048 ,  B81B7/0051 ,  B81B2201/0207 ,  B81C1/00825 ,  B81C2203/035

Abstract: A sealed package having a device disposed on a wafer structure and a lid structure boned to the device wafer. The device wafer includes: a substrate; a metal ring disposed on a surface portion of substrate around the device and a bonding material disposed on the metal ring. The metal ring extends laterally beyond at least one of an inner and outer edge of the bonding material. A first layer of the metal ring includes a stress relief buffer layer having a higher ductility than that of the surface portion of the substrate and a width greater than the width of the bonding material. The metal ring extends laterally beyond at least one of the inner and outer edges of the bonding material. The stress relief buffer layer has a coefficient of thermal expansion greater than the coefficient of expansion of the surface portion of the substrate and less than the coefficient of expansion of the bonding material.

Abstract translation: 密封包装，其具有设置在晶片结构上的装置和骨架到装置晶片上的盖结构。 器件晶片包括：衬底; 设置在所述装置周围的基板的表面部分上的金属环和设置在所述金属环上的接合材料。 金属环横向延伸超过接合材料的内边缘和外边缘中的至少一个。 金属环的第一层包括具有比衬底的表面部分更高的延展性的应力消除缓冲层，并且具有大于接合材料的宽度的宽度。 金属环横向延伸超出接合材料的内边缘和外边缘中的至少一个。 应力消除缓冲层的热膨胀系数大于衬底表面部分的膨胀系数，小于接合材料的膨胀系数。

公开(公告)号：US09334154B2

公开(公告)日：2016-05-10

申请号：US14456476

申请日：2014-08-11

Applicant: Raytheon Company

Inventor： Adam M. Kennedy ,  Buu Q. Diep ,  Stephen H. Black ,  Tse E. Wong ,  Thomas Allan Kocian ,  Gregory D. Tracy

IPC: H01L23/552 ,  B81B7/00

CPC classification number: B81C1/00333 ,  B81B7/0048 ,  B81B7/0051 ,  B81B2201/0207 ,  B81C1/00825 ,  B81C2203/035

Abstract: A sealed package having a device disposed on a wafer structure and a lid structure boned to the device wafer. The device wafer includes: a substrate; a metal ring disposed on a surface portion of substrate around the device and a bonding material disposed on the metal ring. The metal ring extends laterally beyond at least one of an inner and outer edge of the bonding material. A first layer of the metal ring includes a stress relief buffer layer having a higher ductility than that of the surface portion of the substrate and a width greater than the width of the bonding material. The metal ring extends laterally beyond at least one of the inner and outer edges of the bonding material. The stress relief buffer layer has a coefficient of thermal expansion greater than the coefficient of expansion of the surface portion of the substrate and less than the coefficient of expansion of the bonding material.

Abstract translation: 密封包装，其具有设置在晶片结构上的装置和骨架到装置晶片上的盖结构。 器件晶片包括：衬底; 设置在所述装置周围的基板的表面部分上的金属环和设置在所述金属环上的接合材料。 金属环横向延伸超过接合材料的内边缘和外边缘中的至少一个。 金属环的第一层包括具有比衬底的表面部分更高的延展性的应力消除缓冲层，并且具有大于接合材料的宽度的宽度。 金属环横向延伸超出接合材料的内边缘和外边缘中的至少一个。 应力消除缓冲层的热膨胀系数大于衬底表面部分的膨胀系数，小于接合材料的膨胀系数。

公开(公告)号：US20160039665A1

公开(公告)日：2016-02-11

申请号：US14456476

申请日：2014-08-11

Applicant: Raytheon Company

Inventor： Adam M. Kennedy ,  Buu Q. Diep ,  Stephen H. Black ,  Tse E. Wong ,  Thomas Allan Kocian ,  Gregory D. Tracy

IPC: B81B7/00

CPC classification number: B81C1/00333 ,  B81B7/0048 ,  B81B7/0051 ,  B81B2201/0207 ,  B81C1/00825 ,  B81C2203/035

Abstract: A sealed package having a device disposed on a wafer structure and slid structure boned to the device wafer. The device wafer includes: a substrate; a metal ring disposed on a surface portion of substrate around the device and a bonding material disposed on the metal ring. The metal ring extends laterally beyond at least one of an inner and outer edge of the bonding material. A first layer of the metal ring includes a stress relief buffer layer having a higher ductility than that of the surface portion of the substrate and a width greater than the width of the bonding material. The metal ring extends laterally beyond at least one of the inner and outer edges of the bonding material. The stress relief buffer layer has a coefficient of thermal expansion greater than the coefficient of expansion of the surface portion of the substrate and less than the coefficient of expansion of the bonding material.

Abstract translation: 一种密封包装，其具有设置在晶片结构上的装置并且被结合到装置晶片上。 器件晶片包括：衬底; 设置在所述装置周围的基板的表面部分上的金属环和设置在所述金属环上的接合材料。 金属环横向延伸超过接合材料的内边缘和外边缘中的至少一个。 金属环的第一层包括具有比衬底的表面部分更高的延展性的应力消除缓冲层，并且具有大于接合材料的宽度的宽度。 金属环横向延伸超出接合材料的内边缘和外边缘中的至少一个。 应力消除缓冲层的热膨胀系数大于衬底表面部分的膨胀系数，小于接合材料的膨胀系数。